ベンゾトリアゾール誘導体のマイクロコンタクトプリンティングを利用するULSI銅微細配線の形成

概要

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This report describes a new process for ULSI minute copper-wiring formation. It relies on microcontact printing [μCP] of polyethylene glycol bis(1,2,3-benzotriazolylether) [PBTA]—synthesized from polyethylene glycol and benzotriazole—to the surface of copper seed layer, with preferential copper electrodeposition in PBTA-free regions (contact hole and trench) using an acid copper sulfate bath. The copper electrodeposition was done using an insoluble anode in the basic bath without additives. The microcontact printed PBTA on the copper seed-layer surface strongly inhibits copper electrodeposition. Using this process, because of the effect of site-selective printing of PBTA, a minute contact hole can be filled completely with copper without causing voids and seams.
一般社団法人表面技術協会の論文
2009-09-01