ギ酸を還元剤とするモノアミノジカルボン酸錯体浴からの無電解パラジウムめっき

概要

論文の詳細を見る
An electroless Palladium plating aiming “no emission” were investigated using formic acid as the reducing agent, and monoaminodicarboxylic acid as the complexing agent. Stability constants of Pd2+ complexes are log K1=15, log K2=6 for L-glutamic acid (Glu), and log K1=15, log K2=7 for L-aspartic acid (Asp). The potential-pH equilibrium diagram for Pd2+-Glu (or Asp) and HCOO--HCO3- systems indicates that electroless palladium plating is thermodynamically possible when formic acid is used as the reducing agent. These complex baths exhibited good storage stability, and pure palladium films were deposited autocatalytically. Results of testing for solderability and for electrical contact resistance indicated that electroless pure palladium plating is suitable as an alternative to electrolytic and electroless gold plating of electronic parts.
社団法人表面技術協会の論文
1998-12-01