Analysies of the Radiation Caused Characteristics Change in SOI MOSFETS Using Field Shield Isolation
スポンサーリンク
概要
- 論文の詳細を見る
- 1998-09-07
著者
-
IWAMATSU T.
Renesas Technology Corp.
-
HIRANO Y.
Process Technology Development Div. Renesas Technology Crop.
-
IWAMATSU T.
Process Technology Development Div. Renesas Technology Crop.
-
MAEDA S.
ULSI Development Center, Mitsubishi Electric Corporation
-
IWAMATSU T.
ULSI Development Center, Mitsubishi Electric Corporation
-
HIRANO Y.
ULSI Development Center, Mitsubishi Electric Corporation
-
YAMAGUCHI Y.
ULSI Development Center, Mitsubishi Electric Corporation
-
MAEGAWA S.
ULSI Development Center, Mitsubishi Electric Corporation
-
NISHIMURA T.
ULSI Laboratory, Mitsubishi Electric Corporation
-
FERNANDEZ W.
ULSI Development Center, Mitsubishi Electric Corporation
-
Maeda S.
Ulsi Development Center Mitsubishi Electric Corporation
-
Fernandez W.
Ulsi Development Center Mitsubishi Electric Corporation
-
Iwamatsu T.
Ulsi Laboratory Mitsubishi Electric Corporation
関連論文
- Wide-Range V_ Controllable SOTB (Silicon on Thin BOX) Integrated with Bulk CMOS Featuring Fully Silicided NiSi Gate Electrode
- Improvement of Device Characteristics Variation by using a Body-Bias Controlling Technology Based on a Hybrid Trench Isolated SOI
- A Highly Reliable 0.18μm SOI CMOS Technology for 3.3V/1.8V Operation Using Hybrid Trench Isolation and Dual Gate Oxide
- Analysis of the Charge Density at Field Oxide/SOI and SOI/Buried Oxide Interfaces in Partially Depleted SOI MOSFET's with and without Hydrogenation
- A Method of Hot Carrier Lifetime Prediction in Partially-Depleted Floating SOI NMOSFETs
- Direct Measurement of Transient Drain Current in PD-SOI MOSFETs Using Nuclear Microprobe for Highly Reliable Device Design
- Analysies of the Radiation Caused Characteristics Change in SOI MOSFETS Using Field Shield Isolation
- Clarification of Floating-Body Effects on Current Drivability in Deep Sub-Quarter Micron Partially-Depleted SOI MOSFET's
- High Performance 0.2μm Dual Gate CMOS by Suppression of Transient-Enhanced-Diffusion Using Rapid Thermal Annealing Technologies
- High-Speed 0.5μm SOI 1/8 Frequency Divider with Body-Fixed Structure for Wide Range of Applications