Shear Strength in Solder Bump Joints for High Reliability Photodiode Packages
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2003-10-01
著者
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Yang Jun-mo
Memory R&d Division Hynix Semiconductor Inc.
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Kim K‐s
Yeojoo Inst. Of Technol. Yeojoo Kor
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Yang J‐m
Memory R&d Division Hynix Semiconductor Inc.
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Yang J‐m
Hynix Semiconductor Inc. Kyoungki‐do Kor
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YU Chong-Hee
Electronics and Telecommunications Research Institute
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KIM Kyung-Seob
Department of Electronic Engineering, Yeojoo Institute of Technology
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Yu C‐h
Electronics And Telecommunications Research Institute
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Kim Kyung-seob
Department Of Electronic Engineering Yeojoo Institute Of Technology
関連論文
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- Effect of Post Thermal Processes on Nitride/W/WN_x/poly-Si Gate Stack
- Effects of High-Temperature Metal-Organic Chemical Vapor Deposition of Pb(Zr, Ti)O_3 Thin Films on Structural Stabilities of Hybrid Pt/IrO_2/Ir Stack and Single-Layer Ir Bottom Electrodes
- ED2000-50 / SDM2000-50 Oxidation Behaviors of Ti-Polycide Gate Stack During Gate Re-oxidation
- ED2000-50 / SDM2000-50 Oxidation Behaviors of Ti-Polycide Gate Stack During Gate Re-oxidation
- Effect of Au addition on Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder
- Effect of Ag Addition on the Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder
- Aging Treatment Characteristics of Shear Strength in Micro Solder Bump
- Microstructures and Shear Strength of Interfaces between Sn-Zn Lead-free Solders and Au/Ni/Cu UBM
- Shear Strength in Solder Bump Joints for High Reliability Photodiode Packages
- High-resolution transmission electron microscopy and electron energy-loss spectroscopy study of polycrystalline-Si/ZrO_2/SiO_2/Si metal-oxide-semiconductor structures
- Chemical junction delineation of a specific site in Si devices
- Analytical electron microscopy study of nanometre-scate oxide formed in contact-hole-bottom Si surfaces
- Transmission Electron Microscopy Study by Chemical Delineation in Si Devices
- Effects of High-Temperature Metal-Organic Chemical Vapor Deposition of Pb(Zr,Ti)O3 Thin Films on Structural Stabilities of Hybrid Pt/IrO2/Ir Stack and Single-Layer Ir Bottom Electrodes