Microstructures and Shear Strength of Interfaces between Sn-Zn Lead-free Solders and Au/Ni/Cu UBM
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2004-03-20
著者
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Yang Jun-mo
Memory R&d Division Hynix Semiconductor Inc.
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Kim K‐s
Yeojoo Inst. Of Technol. Yeojoo Kor
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Yang J‐m
Memory R&d Division Hynix Semiconductor Inc.
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Yang J‐m
Hynix Semiconductor Inc. Kyoungki‐do Kor
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YU Chong-Hee
Electronics and Telecommunications Research Institute
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KIM Kyung-Seob
Department of Electronic Engineering, Yeojoo Institute of Technology
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Yu C‐h
Electronics And Telecommunications Research Institute
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JEON Hyo-Joeng
R&D Center, Chip PAC Inc.
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Kim Kyung-seob
Department Of Electronic Engineering Yeojoo Institute Of Technology
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Jeon Hyo-joeng
R&d Center Chip Pac Inc.
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- Transmission Electron Microscopy Study by Chemical Delineation in Si Devices
- Effects of High-Temperature Metal-Organic Chemical Vapor Deposition of Pb(Zr,Ti)O3 Thin Films on Structural Stabilities of Hybrid Pt/IrO2/Ir Stack and Single-Layer Ir Bottom Electrodes