KIM Kyung-Seob | Department of Electronic Engineering, Yeojoo Institute of Technology
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概要
関連著者
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KIM Kyung-Seob
Department of Electronic Engineering, Yeojoo Institute of Technology
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Kim Kyung-seob
Department Of Electronic Engineering Yeojoo Institute Of Technology
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YU Chong-Hee
Electronics and Telecommunications Research Institute
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Yang Jun-mo
Memory R&d Division Hynix Semiconductor Inc.
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Kim K‐s
Yeojoo Inst. Of Technol. Yeojoo Kor
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Yang J‐m
Memory R&d Division Hynix Semiconductor Inc.
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Yang J‐m
Hynix Semiconductor Inc. Kyoungki‐do Kor
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Yu C‐h
Electronics And Telecommunications Research Institute
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YANG Jun-Mo
National Nanofab Center, Measurement & Analysis
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Kim N‐h
Chung‐ang Univ. Seoul Kor
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Kim Joong
Institute Of Multidisciplinary Research For Advanced Materials Tohoku University
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Yang Jun-mo
National Nanofab Center
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SUN Yong-Bin
Graduate School of Industrial Technology, Kyonggi University
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KIM Nam-Kyu
School of Electrical and Electronics Engineering, Chung-Ang University
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KIM Nam-Hoon
School of Electrical and Electronics Engineering, Chung-Ang University
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OH Heang-Suk
Electronics and Telecommunications Research Institute
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CHANG Eui-Goo
School of Electrical and Electronics Engineering, Chung-Ang University
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Kawasaki Masahiro
Jeol Ltd.
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JEON Hyo-Joeng
R&D Center, Chip PAC Inc.
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Sun Yong-bin
Graduate School Of Industrial Technology Kyonggi University
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Kim Nam-kyu
School Of Electrical And Electronics Engineering Chung-ang University
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Chang Eui-goo
School Of Electrical And Electronics Engineering Chung-ang University
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Jeon Hyo-joeng
R&d Center Chip Pac Inc.
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LEE Wan-Gyu
National Nanofab Center
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Kawasaki Masahiro
Jeol Ltd
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Kim Joong
Institute Of Molecular Biology And Genetics And Department Of Molecular Biology Seoul National Unive
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Kim Joong
Institute of Multidisciplinary Research for Advanced Materials, Tohoku University
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Kawasaki Masahiro
JEOL Co. Ltd
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Sun Yong-Bin
Graduate School of Industrial Technology and Information, Kyonggi University
著作論文
- Aging Treatment Characteristics of Shear Strength in Micro Solder Bump
- Microstructures and Shear Strength of Interfaces between Sn-Zn Lead-free Solders and Au/Ni/Cu UBM
- Shear Strength in Solder Bump Joints for High Reliability Photodiode Packages
- High-resolution transmission electron microscopy and electron energy-loss spectroscopy study of polycrystalline-Si/ZrO_2/SiO_2/Si metal-oxide-semiconductor structures