Yu C‐h | Electronics And Telecommunications Research Institute
スポンサーリンク
概要
関連著者
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Yang Jun-mo
Memory R&d Division Hynix Semiconductor Inc.
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Kim K‐s
Yeojoo Inst. Of Technol. Yeojoo Kor
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Yang J‐m
Memory R&d Division Hynix Semiconductor Inc.
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Yang J‐m
Hynix Semiconductor Inc. Kyoungki‐do Kor
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YU Chong-Hee
Electronics and Telecommunications Research Institute
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KIM Kyung-Seob
Department of Electronic Engineering, Yeojoo Institute of Technology
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Yu C‐h
Electronics And Telecommunications Research Institute
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Kim Kyung-seob
Department Of Electronic Engineering Yeojoo Institute Of Technology
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JEON Hyo-Joeng
R&D Center, Chip PAC Inc.
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Jeon Hyo-joeng
R&d Center Chip Pac Inc.
著作論文
- Microstructures and Shear Strength of Interfaces between Sn-Zn Lead-free Solders and Au/Ni/Cu UBM
- Shear Strength in Solder Bump Joints for High Reliability Photodiode Packages