Aging Treatment Characteristics of Shear Strength in Micro Solder Bump
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2002-12-01
著者
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Kim N‐h
Chung‐ang Univ. Seoul Kor
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YU Chong-Hee
Electronics and Telecommunications Research Institute
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KIM Kyung-Seob
Department of Electronic Engineering, Yeojoo Institute of Technology
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SUN Yong-Bin
Graduate School of Industrial Technology, Kyonggi University
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KIM Nam-Kyu
School of Electrical and Electronics Engineering, Chung-Ang University
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KIM Nam-Hoon
School of Electrical and Electronics Engineering, Chung-Ang University
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OH Heang-Suk
Electronics and Telecommunications Research Institute
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CHANG Eui-Goo
School of Electrical and Electronics Engineering, Chung-Ang University
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Sun Yong-bin
Graduate School Of Industrial Technology Kyonggi University
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Kim Nam-kyu
School Of Electrical And Electronics Engineering Chung-ang University
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Chang Eui-goo
School Of Electrical And Electronics Engineering Chung-ang University
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Kim Kyung-seob
Department Of Electronic Engineering Yeojoo Institute Of Technology
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Sun Yong-Bin
Graduate School of Industrial Technology and Information, Kyonggi University
関連論文
- Aging Treatment Characteristics of Shear Strength in Micro Solder Bump
- Microstructures and Shear Strength of Interfaces between Sn-Zn Lead-free Solders and Au/Ni/Cu UBM
- Shear Strength in Solder Bump Joints for High Reliability Photodiode Packages
- High-resolution transmission electron microscopy and electron energy-loss spectroscopy study of polycrystalline-Si/ZrO_2/SiO_2/Si metal-oxide-semiconductor structures
- Adhesion Mechanism at Metal-Organic Interface Modified by Plasma