Adhesion Mechanism at Metal-Organic Interface Modified by Plasma
スポンサーリンク
概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2003-08-01
著者
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SUN Yong-Bin
Graduate School of Industrial Technology, Kyonggi University
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Sun Y‐b
Graduate School Of Industrial Technology And Information Kyonggi University
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Sun Yong-bin
Graduate School Of Industrial Technology Kyonggi University
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Sun Yong-Bin
Graduate School of Industrial Technology and Information, Kyonggi University
関連論文
- Aging Treatment Characteristics of Shear Strength in Micro Solder Bump
- Adhesion Mechanism at Metal-Organic Interface Modified by Plasma