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VLSI Research and Development Center, OKI Electric Industry Co., Ltd. | 論文
- Mechanical Effects of Hafnium and Boron Addition to Aluminum Alloy Films for Submicrometer LSI Interconnects
- New Characterization of TiSi_2 Local Wiring Technology and Its Impact on Low Power/High Speed Quarter Micron CMOS
- Effects of Insulator Surface Roughness on Al-Alloy Film Crystallographic Orientation in Al-Alloy/Ti/Insulator Structure
- Influence of Interface Structure between Overlayered Titanium Nitride Film and Aluminum on Multilayered Interconnects
- Interfacial Reactions in Al-Alloy/Ti/Silicon-Dioxide-Based Substrate Structures for Multilayered Interconnects
- Ohmic Contact in Electron Cyclotron Resonance Chemical Vapor Deposition-TiN/Si Structure
- Step Edge Structures on Si(112) and (113) Surfaces Treated in NH_4F Solution
- Dopant Redistribution Effect on Post-Junction Silicide Scheme Shallow Junction and a Proposal of Novel Self-Aligned Silicide Scheme
- Effect of Stress on Oxide Edge Shape of Local Oxidation of Silicon for Various Oxidation Temperatures
- Characterization of Dopant Interdiffusion and Power Reduction on TiSi_2 Local Wiring Technology in Sub-Half-Micron Complementary Metal Oxide Semiconductor
- Influence of Low Dielectric SiOF Film on Metal Oxide Semiconductor Field Effect Transistor Characteristics and Its Impact on Circuit Performance
- Reaction Studies between Fluorocarbon Films and Si Using Temperature-Programmed X-Ray Photoelectron and Desorption Spectroscopies
- Studies of Corrosive Outgasses from Via Holes Using Thermal Desorption Spectroscopy
- X-Ray Photoelectron Spectroscopic Studies on Pyrolysis of Plasma-Polymerized Fluorocarbon Films on Si
- Thermal Desorption and Infrared Studies of Plasma-Enhanced Chemical Vapor Deposited SiO Films with Tetraethyiorthosilicate
- The Effect of Underlayer Texture on Cu Film Orientation in Cu/Refractory-Metal Structure