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Semiconductor Division Electronics And Telecommunications Research Institute | 論文
- Formation of Ferroelectric Thin Films for MFIS or MFMIS Structure
- Formation of Ferroelectric Thin Films for MFIS or MFMIS Structure
- Implementation of 155.52Mbps Physical Layer Processor for ATM Applications
- Implementation of 155.52Mbps Physical Layer Processor for ATM Applications
- Electrical and Microstructural Analyses on the Au/Ni/Au/Ge/Pd Ohmic Contact to n-InGaAs and n-GaAs
- Electrical and Microstructural Analyses on Pd/Ge-Based Ohmic Contact to n-InGaAs
- A 3.3 V 0.8 μm CMOS IF IC for CDMA/FM Cellular Phone
- A 3.3 V 0.8 μm CMOS IF IC for CDMA/FM Cellular Phone
- APPLICATIONS OF CHEMICAL-MECHANICAL-POLISHING PROCESS TO SILICON FIELD EMITTER ARRAY
- POLYCRYSTALLINE SILICON FIELD EMITTER ARRAYS WITH A GATED STRUCTURE
- Fabrication and Characterization of Silicon Field Emission Cathodes using Spin-on-Glass Etch-back Process
- Fabrication and Characterization of Silicon Field Emission Cathodes using Spin-on-Glass Etch-back Process
- Characteristics of MOCVD-Cu Films Using Direct Liquid Injection and the Effects of Post-annealing
- Characteristics of MOCVD-Cu Films Using Direct Liquid Injection and the Effects of Post-annealing
- Implementation of Modem ASIC for CDMA/FM dual-mode Cellular Mobile Phone
- Implementation of Modem ASIC for CDMA/FM dual-mode Cellular Mobile Phone
- Interfacial Reaction between Aluminum Metal and Boron-Doped Polysilicon in a Planar Type Antifuse Device
- A New Low-Resistance Antifuse with Planar Metal/Dielectric/Poly-Si/Dielectric/Metal Structure
- A New Low-Resistance Antifuse with Planar Metal/Dielectric/Poly-Si/Dielectric/Metal Structure
- Low Dielectric Constant Fluorinated Oxide Films Prepared by Remote Plasma Chemical Vapor Deposition