Nemoto Takenao | New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai 980-8579, Japan
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概要
- Nemoto Takenaoの詳細を見る
- 同名の論文著者
- New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai 980-8579, Japanの論文著者
関連著者
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Nemoto Takenao
New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai 980-8579, Japan
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Ohmi Tadahiro
New Industry Creation Hatchery Center (niche) Tohoku University
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Teramoto Akinobu
New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai 980-8579, Japan
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Gu Xun
Graduate School of Engineering, Tohoku University
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Sugawa Shigetoshi
Graduate School Of Engineering Tohoku University
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Gu Xun
Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan
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Tomita Yugo
New Industry Creation Hatchery Center, Tohoku University, Sendai 980-8579, Japan
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NOZAWA Toshihisa
TOKYO ELECTRON LTD.
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MATSUOKA Takaaki
TOKYO ELECTRON LTD.
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KUROKI Shin-Ichiro
Graduate School of Engineering, Tohoku University
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Saito Akane
Tokyo Electron Technology Development Institute, Inc., Nirasaki, Yamanashi 407-0175, Japan
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Miyatani Kotaro
Tokyo Electron Technology Development Institute, Inc., Nirasaki, Yamanashi 407-0175, Japan
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Kobayashi Yasuo
Tokyo Electron Technology Development Institute, Inc., Nirasaki, Yamanashi 407-0175, Japan
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Philipossian Ara
University of Arizona
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Sampurno Yasa
University of Arizona
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Zhuang Yun
University of Arizona
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OHMI Tadahiro
New Industry Creation Hatchery Center, Tohoku University
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Kuroda Rihito
Graduate School Of Engineering Tohoku University
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Cheng Jiang
Araca Inc.
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Kawase Kazumasa
Advanced Technology R&d Center Mitsubishi Electric Corporation
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Tsurekawa Sadahiro
Laboratory Of Materials Design And Interface Engineering Department Of Nanomechanics Graduate School
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Fukino Tatsuya
Laboratory of Material Design for Solar Energy and Interface Engineering, Faculty of Engineering, Kumamoto University, Kumamoto 860-8555, Japan
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Nemoto Takenao
New Industry Creation Hatchery Center, Tohoku University
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Nemoto Takenao
New Industry Creation Hatchery Center, Tohoku University, Sendai 980-8579, Japan
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Philipossian Ara
University of Arizona:Araca, Inc.
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Miyatani Kotaro
Tokyo Electron Technology Development Institute, Sendai 981-3137, Japan
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Kobayashi Yasuo
Tokyo Electron Technology Development Institute, Sendai 981-3137, Japan
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Theng Sian
Araca, Inc.
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Mateo Ricardo
Araca, Inc.
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Borucki Leonard
Araca, Inc.
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Zhuang Yun
University of Arizona:Araca, Inc.
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Kuroda Rihito
Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan
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Tsurekawa Sadahiro
Laboratory of Material Design for Solar Energy and Interface Engineering, Faculty of Engineering, Kumamoto University, Kumamoto 860-8555, Japan
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Kawase Kazumasa
Advanced Technology R&D Center, Mitsubishi Electric Corporation, Amagasaki, Hyogo 661-8661, Japan
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Matsuoka Takaaki
Tokyo Electron Technology Development Institute, Inc., Nirasaki, Yamanashi 407-0175, Japan
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Nozawa Toshihisa
Tokyo Electron Technology Development Institute, Inc., Nirasaki, Yamanashi 407-0175, Japan
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Kuroki Shin-Ichiro
Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan
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Shirotori Akihide
New Industry Creation Hatchery Center, Tohoku University, Sendai 980-8579, Japan
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Shigeyama Haruhisa
Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan
著作論文
- Tribological study for low shear force CMP process on damascene interconnects (シリコン材料・デバイス)
- Tribological effects of brush scrubbing in post chemical mechanical planarization cleaning on electrical characteristics in novel non-porous low-k dielectric fluorocarbon on Cu interconnects (Special issue: Advanced metallization for ULSI applications)
- Electrical characteristics of novel non-porous low-k dielectric fluorocarbon on Cu interconnects for 22nm generation and beyond (Special issue: Advanced metallization for ULSI applications)
- In situ Observation of Grain Growth on Electroplated Cu Film by Electron Backscatter Diffraction
- Integration Process Development for Improved Compatibility with Organic Non-Porous Ultralow-k Dielectric Fluorocarbon on Advanced Cu Interconnects
- Prediction of Stress Induced Voiding Reliability in Cu Damascene Interconnect by Computer Aided Vacancy Migration Analysis