Hanyu Takahiro | Research Institute Of Electrical Communication Tohoku University
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概要
関連著者
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Hanyu Takahiro
Research Institute Of Electrical Communication Tohoku University
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HANYU Takahiro
Research Institute of Electrical Communication, Tohoku University
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望月 明
Research Institute Of Electrical Communication Tohoku University
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MOCHIZUKI Akira
Research Institute of Electrical Communication, Tohoku University
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Mochizuki Akira
The Research Institute Of Electrical Communication Tohoku University
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Onizawa Naoya
Research Institute Of Electrical Communication Tohoku University
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ONIZAWA Naoya
Research Institute of Electrical Communication, Tohoku University
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Hanyu Takahiro
Riec Tohoku University
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HANYU Takahiro
RIEC, Tohoku University
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Shirahama Hirokatsu
Research Institute Of Electrical Communication Tohoku University
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Gaudet Vincent
Department Of Electrical And Computer Engineering University Of Alberta
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SHIRAHAMA Hirokatsu
Research Institute of Electrical Communication, Tohoku University
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MATSUNAGA Shoun
Research Institute of Electrical Communication, Tohoku University
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Takahashi Tomohiro
Research Institute Of Electrical Communication Tohoku University
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IKEDA Shoji
Laboratory for Nanoelectronics and Spintronics, RIEC, Tohoku University
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HASEGAWA Haruhiro
Laboratory for Nanoelectronics and Spintronics, RIEC, Tohoku University
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OHNO Hideo
Laboratory for Nanoelectronics and Spintronics, RIEC, Tohoku University
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MIURA Katsuya
Hitachi Advanced Research Laboratory
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HAYAKAWA Jun
Hitachi Advanced Research Laboratory
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ENDOH Tetsuo
Center for Interdisciplinary Research, Tohoku University
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Endoh Tetsuo
Center For Interdisciplinary Research Tohoku University
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Ohno Hideo
Tohoku Univ. Sendai Jpn
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Ohno Hideo
Laboratory For Electronic Intelligent Systems
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MATSUURA Takashi
Research Institute of Electrical Communication, Tohoku University
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Endoh Testuo
Center For Interdisciplinary Research Tohoku University
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Onizawa Naoya
Tohoku Univ. Sendai‐shi Jpn
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MIZUSAWA Kazuyasu
Research Institute of Electrical Communication, Tohoku University
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GAUDET Vincent
Department of Electrical and Computer Engineering, University of Alberta
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Hasegawa Haruhiro
Riec Tohoku University
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Mizusawa Kazuyasu
Research Institute Of Electrical Communication Tohoku University
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Endoh Tetsuo
Tohoku Univ. Sendai‐shi Jpn
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Miura Masatomo
Research Institute Of Electrical Communication Tohoku University
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TAKEUCHI Takashi
Research Laboratory of Komatsu Factory Co., Ltd.
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KIMURA Hiromitsu
Semiconductor Research and Development Headquarters, Rohm Co., Ltd.
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IBUKI Mitsuru
Research Institute of Electrical Communication, Tohoku University
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NISHINOHARA Daisuke
Research Institute of Electrical Communication, Tohoku University
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Ibuki Mitsuru
Research Institute Of Electrical Communication Tohoku University
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Mizunuma Kotaro
Hitachi Advanced Research Laboratory
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Matsunaga Shoun
Laboratory For Brainware Systems Research Institute Of Electrical Communication Tohoku University
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TAKAHASHI Tomohiro
Research Institute of Electrical Communication, Tohoku University
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Nishinohara Daisuke
Research Institute Of Electrical Communication Tohoku University
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Matsuura Takashi
Research Institute Of Electrical Communication Tohoku University
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NATSUI Masanori
Research Institute of Electrical Communication, Tohoku University
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Natsui Masanori
Research Institute Of Electrical Communication Tohoku University
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Kimura Hiromitsu
Semiconductor Research And Development Headquarters Rohm Co. Ltd.
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Takeuchi Takashi
Research Institute Of Electrical Communication Tohoku University
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Takeuchi Takashi
Research And Development Center Oita University
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Ikeda Shoji
Laboratory for Nanoelectronics and Spintronics, Research Institute of Electrical Communication, Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai 980-8577, Japan
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Gross Warren
Department of Electrical and Computer Engineering, McGill University
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ONIZAWA Naoya
Dept. of Electrical and Computer Engineering, McGill University
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Onizawa Naoya
Department of Electrical and Computer Engineering, McGill University
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MATSUMOTO Atsushi
Gunma National College of Technology
著作論文
- Power-Aware Asynchronous Peer-to-Peer Duplex Communication System Based on Multiple-Valued One-Phase Signaling
- High-Throughput Bit-Serial LDPC Decoder LSI Based on Multiple-Valued Asynchronous Interleaving
- Design and Evaluation of a 54×54-bit Multiplier Based on Differential-Pair Circuitry(Digital,Low-Power, High-Speed LSIs and Related Technologies)
- Design of a Low-Power Quaternary Flip-Flop Based on Dynamic Differential Logic(Novel Device Architectures and System Integration Technologies)
- TMR-Based Logic-in-Memory Circuit for Low-Power VLSI(Papers Selected from ITC-CSCC 2004)
- Dynamically Function-Programmable Bus Architecture for High-Throughput Intra-Chip Data Transfer(New System Paradigms for Integrated Electronics)
- Low-Power Motion-Vector Detection VLSI Processor Based on Pass-Gate Logic with Dynamic Supply-Voltage/Clock-Frequency Scaling(New System Paradigms for Integrated Electronics)
- Low-Power Multiple-Valued Current-Mode Logic Using Substrate Bias Control(Low-Power System LSI, IP and Related Technologies)
- Design and Evaluation of a NULL-Convention Circuit Based on Dual-Rail Current-Mode Differential Logic(Novel Device Architectures and System Integration Technologies)
- Fabrication of a Nonvolatile Full Adder Based on Logic-in-Memory Architecture Using Magnetic Tunnel Junctions
- Highly Reliable Multiple-Valued One-Phase Signalling for an Asynchronous On-Chip Communication Link
- Differential Operation Oriented Multiple-Valued Encoding and Circuit Realization for Asynchronous Data Transfer(New System Paradigms for Integrated Electronics)
- Highly Reliable Multiple-Valued Current-Mode Comparator Based on Active-Load Dual-Rail Operation
- Energy-Aware Multiple-Valued Current-Mode Sequential Circuits Using a Completion-Detection Scheme
- Implementation of a High-Speed Asynchronous Data-Transfer Chip Based on Multiple-Valued Current-Signal Multiplexing(Novel Device Architectures and System Integration Technologies)
- High-throughput CAM based on a synchronous overlapped search scheme
- Open-Fault Resilient Multiple-Valued Codes for Reliable Asynchronous Global Communication Links
- Special Section on Novel Device Architectures and System Integration Technologies