Chiang Chiu-chih | Department Of Electronics Engineering National Chiao-tung University
スポンサーリンク
概要
関連著者
-
CHEN Mao-Chieh
Department of Electronics Engineering & The Institute of Electronics, National Chiao Tung University
-
Chiang Chiu-chih
Department Of Electronics Engineering National Chiao-tung University
-
KO Chung-Chi
Taiwan Semiconductor Manufacturing Company
-
JANG Syun-Ming
Taiwan Semiconductor Manufacturing Company
-
Wu Zhen-cheng
Taiwan Semiconductor Manufacturing Company
-
Liang M‐s
Taiwan Semiconductor Manufacturing Co. Hsinchu Twn
-
Liang Mong-song
Taiwan Semiconductor Manufacturing Company
-
CHIANG Chiu-Chih
Department of Electronics Engineering, National Chiao-Tung University
-
YU Chen-Hua
Taiwan Semiconductor Manufacturing Company
-
LIANG Mong-Song
Taiwan Semiconductor Manufacturing Co., Ltd.
-
Liang Mong-song
Taiwan Semiconductor Manufacturing Co. Ltd.
-
Chiang Chiu-Chih
Department of Electronics Engineering, National Chiao-Tung University, 1001 Ta Hsueh Road, Hsinchu 300, Taiwan
-
WU Zhen-Cheng
Department of Electronics Engineering, National Chiao-Tung University
-
CHEN Hsi-Ping
Taiwan Semiconductor Manufacturing Company
-
JANG Syun-Ming
Department of Dielectric and CMP, Advanced Module Technology Division, Taiwan Semiconductor Manufact
-
LIANG Mong-Song
Department of Dielectric and CMP, Advanced Module Technology Division, Taiwan Semiconductor Manufact
-
Chen Mao-Chieh
Department of Electronics Engineering, National Chiao-Tung University, 1001 Ta Hsueh Road, Hsinchu 300, Taiwan
-
Wu Zhen-Cheng
Department of Dielectric and CMP, Advanced Module Technology Division, Taiwan Semiconductor Manufacturing Company, Science-Based Industrial Park, Hsinchu 300, Taiwan
-
Wu Wei-hao
Department Of Electronics Engineering National Chiao Tung University
-
LI Lain-Jong
Department of Dielectric and CMP, Advanced Module Technology Division, Taiwan Semiconductor Manufact
-
Wu Wei-hao
Department Of Electronics Engineering And Institute Of Electronics National Chiao-tung University
-
Li Lain-jong
Department Of Chemistry National Taiwan University
-
Wu Zhen-Cheng
Taiwan Semiconductor Manufacturing Company, Science-Based Industrial Park Hsinchu, Taiwan
-
Ko Chung-Chi
Taiwan Semiconductor Manufacturing Company, No. 9, Creation Rd. I, Science-Based Industrial Park HsinChu, Taiwan
-
Liang Mong-Song
Taiwan Semiconductor Manufacturing Company, No. 9, Creation Rd. I, Science-Based Industrial Park HsinChu, Taiwan
-
Yu Chen-Hua
Taiwan Semiconductor Manufacturing Company, No. 9, Creation Rd. I, Science-Based Industrial Park HsinChu, Taiwan
-
Chen Hsi-Ping
Taiwan Semiconductor Manufacturing Company, No. 9, Creation Rd. I, Science-Based Industrial Park HsinChu, Taiwan
-
Wu Wei-Hao
Department of Electronics Engineering, National Chiao-Tung University, 1001 Ta Hsueh Road, Hsinchu 300, Taiwan
-
Ko Chung-Chi
Taiwan Semiconductor Manufacturing Company, Science-Based Industrial Park Hsinchu, Taiwan
-
Li Lain-Jong
Department of Dielectric and CMP, Advanced Module Technology Division, Taiwan Semiconductor Manufacturing Company, Science-Based Industrial Park, Hsinchu 300, Taiwan
-
Liang Mong-Song
Department of Dielectric and CMP, Advanced Module Technology Division, Taiwan Semiconductor Manufacturing Company, Science-Based Industrial Park, Hsinchu 300, Taiwan
-
Liang Mong-Song
Taiwan Semiconductor Manufacturing Company, Science-Based Industrial Park Hsinchu, Taiwan
-
Wu Zhen-Cheng
Department of Electronics Engineering, National Chiao-Tung University, 1001 Ta Hsueh Road, Hsinchu 300, Taiwan
-
Jang Syun-Ming
Department of Dielectric and CMP, Advanced Module Technology Division, Taiwan Semiconductor Manufacturing Company, Science-Based Industrial Park, Hsinchu 300, Taiwan
-
Jang Syun-Ming
Taiwan Semiconductor Manufacturing Company, No. 9, Creation Rd. I, Science-Based Industrial Park HsinChu, Taiwan
著作論文
- Physical and Barrier Properties of Plasma Enhanced Chemical Vapor Deposition α-SiC : N : H Films
- Effects of O_2- and N_2-Plasma Treatments on Copper Surface
- Physical and Barrier Properties of Plasma-Enhanced Chemical Vapor Deposited α-SiC : H Films from Trimethylsilane and Tetramethylsilane
- Physical and Barrier Properties of Plasma-Enhanced Chemical Vapor Deposited α-SiCN:H Films with Different Hydrogen Contents
- Physical and Barrier Properties of Plasma-Enhanced Chemical Vapor Deposited $\alpha$-SiC:H Films from Trimethylsilane and Tetramethylsilane
- Physical and Barrier Properties of Plasma-Enhanced Chemical Vapor Deposited $\alpha$-SiCN:H Films with Different Hydrogen Contents
- Effects of O2- and N2-Plasma Treatments on Copper Surface
- Physical and Barrier Properties of Plasma Enhanced Chemical Vapor Deposition $\alpha$-SiC:N:H Films