Uesugi Tsutomu | Toyota Central R&d Labs. Inc.
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概要
関連著者
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Uesugi Tsutomu
Toyota Central R&d Labs. Inc.
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Uesugi Tsutomu
Toyota Central R&d Laboratories Inc.
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Kachi Tetsu
Toyota Central R&D Labs., Inc.
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Kachi Tetsu
Toyota Central R & D Laboratories Inc.
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Hashizume Tamotsu
Rcieq Hokkaido University
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Uesugi Tsutomu
Toyota Central R&D Labs., Inc.
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Hashizume Tamotsu
RCIEQ, Hokkaido University
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Uesugi T
Waseda Univ. Tokyo Jpn
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Kato M
Toyota Central R&d Laboratories Inc.
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Kachi Tetsu
Toyota Central R&d Labs. Inc.
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Kachi Tetsu
Toyota Central R&d Laboratories Inc.
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Hayakawa Tetsuo
Toyota Central R&d Labs. Inc.:(present Address) Nanotech Laboratory Canare Electric Co. Ltd.
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SUZUKI Takashi
TOYOTA Central R&D Labs., Inc.
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MITSUSHIMA Yasuichi
TOYOTA Central R&D Labs., Inc.
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Kato M
Japan Atomic Energy Res. Inst. Ibaraki Jpn
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Kato Masatsune
Department Of Applied Physics Faculty Of Engineering Tohoku University
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KODAMA Masahito
Toyota Central R&D Laboratories, Inc.
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SUGIMOTO Masahiro
Toyota Motor Corp.
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HAYASHI Eiko
Toyota Central R&D Laboratories, Inc.
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SOEJIMA Narumasa
Toyota Central R&D Laboratories, Inc.
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ISHIGURO Osamu
Toyota Central R&D Laboratories, Inc.
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KANECHIKA Masakazu
Toyota Central R&D Laboratories, Inc.
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ITOH Kenji
Toyota Central R&D Laboratories, Inc.
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UEDA Hiroyuki
Toyota Central R&D Laboratories, Inc.
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Hayashi Eiko
Toyota Central R&d Laboratories Inc.
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Ishiguro Osamu
Toyota Central R&d Laboratories Inc.
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Soejima Narumasa
Toyota Central R&d Laboratories Inc.
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Kanechika Masakazu
Toyota Central R&d Laboratories Inc.
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Mitsushima Y
Toyota Central R&d Lab. Inc. Aichi Jpn
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Mitsushima Yasuichi
Toyota Central R & D Laboratories Inc.
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Itoh Kenji
Toyota Central R&d Laboratories Inc.
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Ueda Hiroyuki
Toyota Central R&d Laboratories Inc.
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Suzuki Takashi
Toyota Central R&d Labs. Inc.
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Kachi Tetsu
Toyota Central R&D Labs., Inc.
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Kodama Masahito
Toyota Central R&D Laboratories, Inc., Nagakute-cho, Aichi 480-1192, Japan
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Uesugi Tsutomu
Toyota Central R&D Labs., Inc.
著作論文
- Characteristics of GaN p-n diode with damage layer induced by ICP plasma process(Session 6B : Wide Bandgap Materials and Devices, Power Devices)
- Mechanism of Residue Formation in Silicon Trench Etching Using a Bromine-Based Plasma
- GaN-Based Trench Gate Metal Oxide Semiconductor Field-Effect Transistor Fabricated with Novel Wet Etching
- Characteristics of GaN p-n diode with damage layer induced by ICP plasma process(Session 6B : Wide Bandgap Materials and Devices, Power Devices)
- Electrical Characterization of GaN p--n Junctions Grown on Freestanding GaN Substrates by Metal--Organic Chemical Vapor Deposition