HU Cheng-Yu | Institute of Technology and Science, The University of Tokushima
スポンサーリンク
概要
関連著者
-
AO Jin-Ping
Institute of Technology and Science, The University of Tokushima
-
HU Cheng-Yu
Institute of Technology and Science, The University of Tokushima
-
OHNO Yasuo
Institute of Technology and Science, The University of Tokushima
-
Ohno Yasuo
Univ. Tokushima Tokushima‐shi Jpn
-
Ao Jin‐ping
Univ. Tokushima Tokushima‐shi Jpn
-
Ao Jin-ping
Satellite Venture Business Laboratory The University Of Tokushima
-
Ao J‐p
Univ. Tokushima Tokushima‐shi Jpn
-
Hu Cheng‐yu
Univ. Tokushima Tokushima Jpn
-
Ohno Yasuo
Institute Of Technology And Science The University Of Tokushima
-
Hu Cheng-yu
Institute Of Technology And Science The University Of Tokushima
-
OKADA Masaya
Institute of Technology and Science, The University of Tokushima
-
Okada Masaya
Univ. Tokushima Tokushima‐shi Jpn
-
YAMAOKA Yuya
Institute of Technology and Science, The University of Tokushima
-
NAKATANI Katsutoshi
Institute of Technology and Science, the University of Tokushima
-
KAWAI Hiroji
Powdec K.K
-
岡田 政也
徳島大学ソシオテクサイエンス研究部
-
Okada Masaya
Institute Of Technology And Science The University Of Tokushima
-
Okada Masaya
Dept. of Electrical and Electronic Eng., The University of Tokushima, Tokushima 770-8506, Japan
-
Yamaoka Yuya
Institute Of Technology And Science The University Of Tokushima
-
IKAWA Yusuke
Institute of Technology and Science, the University of Tokushima
-
YUASA Yorihide
Institute of Technology and Science, the University of Tokushima
-
Nakatani Katsutoshi
Institute Of Technology And Science The University Of Tokushima
-
Ikawa Yusuke
Institute Of Technology And Science The University Of Tokushima
-
Yuasa Yorihide
Institute Of Technology And Science The University Of Tokushima
著作論文
- Buffer Layer Doping Concentration Measurement Using VT-VSUB Characteristics of GaN HEMT with p-GaN Substrate Layer
- Investigation on Current Collapse of AlGaN/GaN HFET by Gate Bias Stress
- A Study on Ohmic Contact to Dry-Etched p-GaN
- Investigation on Current Collapse of AlGaN/GaN HFET by Gate Bias Stress
- Buffer Layer Doping Concentration Measurement Using V_T-V_ Characteristics of GaN HEMT with p-GaN Substrate Layer
- 2D Device Simulation of AlGaN/GaN HFET Current Collapse Caused by Surface Negative Charge Injection