UV Nanoimprint in Pentafluoropropane at a Minimal Imprint Pressure

概要

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UV nanoimprint in air and in pentafluoropropane (PFP) was carried out at imprint pressures ranging from 200 down to 10 kPa using a mold with fractal structure recesses with nominal sizes of 1.3, 3.9, 11.7, 35, 105, and 316 μm. While UV nanoimprint in air suffered severe bubble defect problems, UV nanoimprint in PFP was free from the bubble defect problem even at 10 kPa. From real-time monitoring of recesses being filled with resin for UV nanoimprint in PFP, it was found that the recesses are filled in the ascending order of sizes and filling is completed in 2–4 s. No imprint pressure by the imprint apparatus is needed for UV nanoimprint in PFP, and a full wetting can be spontaneously realized even at a concave area where a large amount of gas is liable to be trapped. This suggests that a capillary force must play an important role of filling at the initial stage of contact and filling between unparallel surfaces of the mold and wafer.
2010-06-25