Effect of Magnetic Field on Permeability of Electroplated Permalloy for Microdevices
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概要
- 論文の詳細を見る
We have investigated the effect of a magnetic field on an electroplated Ni79Fe21 film. We have succeeded in the formation of a Ni79Fe21 (permalloy) film with high permeability by applying the magnetic field vertical to the electric field during the electroplating process. In a conventional NiFe electroplating process, annealing is required to obtain a stable Ni79Fe21 film after electroplating. This process without annealing is useful for fabricating Ni79Fe21 films for flexible devices and complementary metal oxide semiconductor (CMOS) integration.
- 2010-04-25
著者
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Aoki Hidemitsu
Department of Electrical Electronic and Information Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan
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Hidemitsu Aoki
Department of Electrical Electronic and Information Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan
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Ooi Naoki
Department of Electrical, Electronic and Information Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan
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Jong-Hyeon Jeong
Department of Electrical Electronic and Information Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan
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Kubo Eitaro
Department of Electrical Electronic and Information Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan
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Daisuke Watanabe
Department of Electrical Electronic and Information Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan
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Chiharu Kimura
Department of Electrical Electronic and Information Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan
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Takashi Sugino
Department of Electrical Electronic and Information Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan
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Ooi Naoki
Department of Electrical Electronic and Information Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan
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Eitaro Kubo
Department of Electrical Electronic and Information Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan
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