Low-Temperature Bumpless Bonding for Surface Acoustic Wave Components
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概要
- 論文の詳細を見る
A low-temperature bonding process for surface acoustic wave (SAW) components was developed in ambient air by the surface activated bonding (SAB) method. In this method, the assembly was achieved using not Au bumps but Au bumpless structures directly. The required bonding pressure was optimized. To compare this method with conventional thermocompression bonding and thermosonic bonding methods, die shear and electrical tests were performed to determine the mechanical and electrical properties, respectively. Under optimized parameters, the bonding feasibility of miniaturized SAW components was confirmed at 25–100 °C in ambient air with the proper signal output and a high bonding strength. Scanning electron microscopy and energy dispersive X-ray spectrometry observations showed that no intermetallic compound formed around the bond interfaces.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2008-04-25
著者
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Wang Ying-hui
Department Of Precision Engineering School Of Engineering The University Of Tokyo
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Suga Tadatomo
Department Of Precision Engineering Faculty Of Engineering University Of Tokyo
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Sugiura Tsuyoshi
Wireless Communication Laboratory Samsung Yokohama Research Institute
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Sato Takahiro
Wireless Communication Laboratory Samsung Yokohama Research Institute
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Wang Ying-Hui
Department of Precision Engineering, School of Engineering, The University of Tokyo, Tokyo 113-8656, Japan
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Suga Tadatomo
Department of Precision Engineering, School of Engineering, The University of Tokyo, Tokyo 113-8656, Japan
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Sugiura Tsuyoshi
Wireless Communication Laboratory, Samsung Yokohama Research Institute, Yokohama 230-0027, Japan
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