Void Free Room Temperature Silicon Direct Bonding by Sequential Plasma Activated Process
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概要
- 論文の詳細を見る
- 2007-09-19
著者
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Higurashi Eiji
Research Center For Advanced Science And Technology The University Of Tokyo
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Wang Chenxi
Department Of Precision Engineering School Of Engineering The University Of Tokyo
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Suga Tadatomo
Department Of Precision Engineering Faculty Of Engineering University Of Tokyo
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