Miniaturization of a Laser Doppler Blood Flow Sensor by System-in-Package Technology : Fusion of an Optical Microelectromechanical Systems Chip and Integrated Circuits
スポンサーリンク
概要
- 論文の詳細を見る
- 2010-03-01
著者
-
Higurashi Eiji
Research Center For Advanced Science And Technology The University Of Tokyo
-
Higurashi Eiji
Research Center For Advanced Science And Technology University Of Tokyo
-
Iwasaki Wataru
Graduate School Of Systems Life Sciences Kyushu University
-
Sawada Renshi
Graduate School Of Systems Life Sciences Kyushu University
-
NOGAMI Hirofumi
Graduate School of Systems Life Sciences, Kyushu University
-
Nogami Hirofumi
Graduate School Of Systems Life Sciences Kyushu University
関連論文
- Room-temperature bonding of GaN to Al using Ar-beam surface activation (特集 マイクロ加工および支援技術)
- Low-Temperature Direct Bonding of Flip-Chip Mountable VCSELs with Au-Au Surface Activation
- Real-time Observation of Hydrogen Plasma Reflow Process with Lead-free Solder Pastes
- Room-Temperature Bonding of Vertical-Cavity Surface-Emitting Laser Chips on Si Substrates Using Au Microbumps in Ambient Air
- Void Free Room Temperature Silicon Direct Bonding by Sequential Plasma Activated Process
- Miniaturization of a Laser Doppler Blood Flow Sensor by System-in-Package Technology : Fusion of an Optical Microelectromechanical Systems Chip and Integrated Circuits
- Maskless Lithographic Fine Patterning on Deeply Etched or Slanted Surfaces, and Grayscale Lithography, Using Newly Developed Digital Mirror Device Lithography Equipment
- Void-Free Room-Temperature Silicon Wafer Direct Bonding Using Sequential Plasma Activation