Low Temperature Interconnection of Cu Micro-bump on Polyimide and Ni/Au Film by Surface Activated Flip Chip Method
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概要
- 論文の詳細を見る
- 2006-09-13
著者
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SUGA Tadatomo
Department of Precision Engineering, School of Engineering, The University of Tokyo
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Suga Tadatomo
Department Of Precision Engineering Faculty Of Engineering University Of Tokyo
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XU Zhonghua
Department of Precision Engineering, School of Engineering, The University of Tokyo
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Xu Zhonghua
Department Of Precision Engineering School Of Engineering The University Of Tokyo
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- Evaluation of Alignment Accuracy for Wafer Bonding Using Moire Technique
- Void Free Room Temperature Silicon Direct Bonding by Sequential Plasma Activated Process
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