SAW Bumpless Bonding at Low Temperature in Ambient Air
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概要
- 論文の詳細を見る
- 2007-09-19
著者
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Suga Tadatomo
Univ. Tokyo Tokyo Jpn
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WANG Ying-Hui
Univ. of Tokyo, Dept. of Precision Eng. School of Eng.
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SATO Takahiro
Wireless Communication Laboratory, Samsung Yokohama Research Institute
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SUGIURA Tsuyoshi
Wireless Communication Laboratory, Samsung Yokohama Research Institute
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Wang Ying-hui
Univ. Of Tokyo Dept. Of Precision Eng. School Of Eng.
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Sugiura Tsuyoshi
Wireless Communication Laboratory Samsung Yokohama Research Institute
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Suga Tadatomo
Univ. Of Tokyo Dept. Of Precision Eng. School Of Eng.
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Sato Takahiro
Wireless Communication Laboratory Samsung Yokohama Research Institute
関連論文
- SAW Bumpless Bonding at Low Temperature in Ambient Air
- Pressure Dependence of Resonant Characteristics of Lateral Comb Drive Resonators in the Free-Molecule Regime
- Room Temperature Vacuum Sealing with Au Thin Films Using Ar Beam Surface Activation
- Low-Temperature Bumpless Bonding for Surface Acoustic Wave Components