Bonding of Lead Zirconate Titanate Ceramics to Si Single Crystals for Microdevices
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概要
- 論文の詳細を見る
Bonding bulk lead zirconate titanate (PZT) ceramics having excellent piezoelectric properties to micromachinable Si single crystals could be used to produce microdevices that exploit piezoelectricity. The technique of bonding PZT ceramics to Si wafers using an intermediate gold layer was investigated. Well-bonded wafers with bonding strengths of more than 20 MPa were obtained by heating the wafers at 550°C for 2 h under the pressure of 0.8 MPa. A cantilever made of PZT-Au-Si-bonded wafer operated as a piezoelectric actuator, which exhibited a sufficient bonding strength.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2004-09-15
著者
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Sugiyama Susumu
Faculty Of Science And Egineering Ritsumeikan University
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Kuze Wataru
Faculty Of Science And Engineering Ritsumeikan University
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Konishi Takahiro
Faculty Of Science And Engineering Ritsumeikan University
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Tanaka Katsuhiko
Faculty Of Engineering Science Osaka University:(present Address) Murata Manufacturing Co. Ltd.
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Konishi Takahiro
Faculty of Science and Engineering, Ritsumeikan University, 1-1-1 Nojihigashi, Kusatsu 525-8577, Japan
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Kuze Wataru
Faculty Of Science and Engineering, Ritsumeikan University, 1-1-1 Nojihigashi, Kusatsu 525-8577, Japan
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Sugiyama Susumu
Faculty of Science and Engineering, Ritsumeikan University, 1-1-1 Nojihigashi, Kusatsu 525-8577, Japan
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