Effects of Selecting Channel Direction in Improving Performance of Sub-100 nm MOSFETs Fabricated on (110) Surface Si Substrate
スポンサーリンク
概要
- 論文の詳細を見る
We investigated the low field mobility and short channel characteristics of metal-oxide-semiconductor field-effect transistors (MOSFETs) on (110) surface Si substrates with various channel directions from the viewpoints of experiment and numerical simulation. We found that the mobility ($\mu$) ratio of (110) substrates to (001) substrates ($\mu_{(110)}/\mu_{(001)}$) does not depend on the vertical electric field due to the identical surface roughness for (110) and (001) substrates. We verified mobility enhancement and its channel direction dependence by conducting a detailed carrier transport simulation using a full band model and relaxation time approximation. We obtained good threshold voltage ($V_{\text{th}}$) lowering characteristics due to the suppression of channeling at the source and drain (SD) extension by implant sequence control. Our results showed that the improvement in propagation delay time ($CV/I$) and on-current ratio of nMOS to pMOS (${I_{\text{on}}}^{\text{n}}/{I_{\text{on}}}^{\text{p}}$) obtained by using an optimized combination of channel directions and a (110) surface Si substrate is attractive for future LSIs down to the sub-100 nm region.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2004-04-15
著者
-
NAKAMURA Hidetatsu
Silicon Systems Research Labs., NEC Corporation
-
IWAMOTO Toshiyuki
Silicon Systems Research Labs., NEC Corporation
-
Hane Masami
Silicon Systems Research Laboratories Nec Corporation
-
Ezaki Tatsuya
Silicon Systems Research Laboratories Nec Corporation
-
Yamamoto Toyoji
Silicon Systems Research Laboratories Nec Corporation
-
Ikezawa Takeo
Platform Software Division Nec Infomatec Systems Ltd.
-
Togo Mitsuhiro
Silicon Systems Research Labs. Nec Corporation
-
Ikarashi Nobuyuki
Silicon Systems Research Laboratories Nec Corporation
-
Hane Masami
Silicon Systems Research Labs., NEC Corporation, 1120 Shimokuzawa, Sagamihara, Kanagawa 229-1198, Japan
-
Yamamoto Toyoji
Silicon Systems Research Labs., NEC Corporation, 1120 Shimokuzawa, Sagamihara, Kanagawa 229-1198, Japan
-
Ikarashi Nobuyuki
Silicon Systems Research Labs., NEC Corporation, 1120 Shimokuzawa, Sagamihara, Kanagawa 229-1198, Japan
-
Togo Mitsuhiro
Silicon Systems Research Labs., NEC Corporation, 1120 Shimokuzawa, Sagamihara, Kanagawa 229-1198, Japan
-
Ezaki Tatsuya
Silicon Systems Research Labs., NEC Corporation, 1120 Shimokuzawa, Sagamihara, Kanagawa 229-1198, Japan
-
Ikezawa Takeo
Platform Software Division, NEC Infomatec Systems, Ltd., 3-2-1 Sakado, Takatsu-ku, Kawasaki, Kanagawa 213-0012, Japan
-
Iwamoto Toshiyuki
Silicon Systems Research Labs., NEC Corporation, 1120 Shimokuzawa, Sagamihara, Kanagawa 229-1198, Japan
-
Nakamura Hidetatsu
Silicon Systems Research Labs., NEC Corporation, 1120 Shimokuzawa, Sagamihara, Kanagawa 229-1198, Japan
関連論文
- 70nm MOSFET Device Simulation Considering Two Dimensional Channel Quantization and Self-Consistent Non-Equilibrium Carrier Transport
- Effects of Selecting Channel Direction in Improving Performance of Sub-100nm MOSFETs Fabricated on (110) Surface Si Substrate
- Suppression of Charges in Al_2O_3 Gate Dielectric and Improvement of MOSFET Performance by Plasma Nitridation(High-κ Gate Dielectrics)
- Suppression of Charges in Al_2O_3 Gate Dielectric and Improvement of MOSFET Performance by Plasma Nitridation
- Impact of 1-2nm Gate Oxide for Sub-Quarter Micron Dual Gate CMOS
- Three Dimensional MOSFET Simulation for Analyzing Statistical Dopant-Induced Fluctuations Associated with Atomistic Process Simulator(the IEEE International Coference on SISPAD '02)
- First observation of SiO_2/Si(100) interfaces by spherical aberration-corrected high-resolution transmission electron microscopy
- Quantitative Characterization of Roughness at SiO_2/Si Interfaces by Using Cross-sectional High-resolution Transmission Electron Microscopy
- Effects of Selecting Channel Direction in Improving Performance of Sub-100 nm MOSFETs Fabricated on (110) Surface Si Substrate