Microstrip Silicon-MEMS Package for Wafer-Level Chip-Scale Microwave Packaging

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概要

• 論文の詳細を見る

• A new Micro Electro Mechanical System (MEMS) microstrip package using two high resistivity silicon (HRS) substrates without metal shielding is fabricated for microwave device packaging. The simple package is manufactured using common silicon MEMS technology and the de-embedding measurement shows the small insertion loss (0.3 dB) below 20 GHz and no package resonance. This package also allows the wafer-level chip-scale packaging and is suitable for low cost packaging of various microwave devices.

• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2003-09-15

著者

• KWON Young-Soo

  Department of Electrical Engineering & NTRC, Dong-A University

• Park Jae-young

  Lg Electronics Institute Of Technology

• Song Yo-tak

  Department Of Electronics Engineering Ajou University

• Lee Hai-young

  Department Of Electronics Engineering Ajou University

• Park Jae-Young

  LG Electronics Institute of Technology, 16, Woomyon-dong, Seocho-gu, Seoul, Korea

• Kwon Young-Soo

  Department of Electronics Engineering, Ajou University, 5 Wonchon-dong, Paldal-gu, Suwon, Kyunggi 442-749, Korea

• Song Yo-Tak

  Department of Electronics Engineering, Ajou University, 5 Wonchon-dong, Paldal-gu, Suwon, Kyunggi 442-749, Korea

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