Lee Hai-young | Department Of Electronics Engineering Ajou University
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概要
関連著者
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Lee Hai-young
Department Of Electronics Engineering Ajou University
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Song Yo-tak
Department Of Electronics Engineering Ajou University
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江刺 正喜
東北大学wpi-aimr
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SONG Yo-Tak
Department of Electronics Engineering, Ajou University
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LEE Hai-Young
Department of Electronics Engineering, Ajou University
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ESASHI Masayoshi
Department of Nanomechanics, Graduate School of Engineering, Tohoku University
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KWON Young-Soo
Department of Electrical Engineering & NTRC, Dong-A University
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Park Jae-young
Lg Electronics Institute Of Technology
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Esashi Masayoshi
Department Of Nanomechanics Tohoku University
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Esashi Masayoshi
Department Of Nanomechanics Graduate School Of Engineering Tohoku University
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Esashi Masayoshi
New Industry Creation Hatchery Center (niche) Tohoku University
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Park Jae-Young
LG Electronics Institute of Technology, 16, Woomyon-dong, Seocho-gu, Seoul, Korea
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Lee Hai-Young
Department of Electronics Engineering, Ajou University, 5 Wonchon-dong, Youngtong-gu, Suwon, Kyunggi 443-749, Korea
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Kwon Young-Soo
Department of Electronics Engineering, Ajou University, 5 Wonchon-dong, Paldal-gu, Suwon, Kyunggi 442-749, Korea
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Song Yo-Tak
Department of Electronics Engineering, Ajou University, 5 Wonchon-dong, Paldal-gu, Suwon, Kyunggi 442-749, Korea
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Song Yo-Tak
Visiting Researcher, Graduate School of Engineering, Tohoku University, 6-6-01 Aza Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan
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Esashi Masayoshi
New Industry Creation Hatchery Center (NICHe), Tohoku University, 6-6-01 Aza Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan
著作論文
- Low Actuation Voltage Capacitive Shunt RF-MEMS Switch Having a Corrugated Bridge(Passive Circuits/Components,Emerging Microwave Techniques)
- Microstrip Silicon-MEMS Package for Wafer-Level Chip-Scale Microwave Packaging
- Resonance-free Millimeter-wave Coplanar Waveguide Si Microelectromechanical System Package using a Lightly-doped Silicon Chip Carrier