Microstrip Silicon-MEMS Package for Wafer-Level Chip-Scale Microwave Packaging

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概要

• 論文の詳細を見る
• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2003-09-15

著者

• SONG Yo-Tak

  Department of Electronics Engineering, Ajou University

• LEE Hai-Young

  Department of Electronics Engineering, Ajou University

• KWON Young-Soo

  Department of Electrical Engineering & NTRC, Dong-A University

• Park Jae-young

  Lg Electronics Institute Of Technology

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