Microstrip Silicon-MEMS Package for Wafer-Level Chip-Scale Microwave Packaging
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概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2003-09-15
著者
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SONG Yo-Tak
Department of Electronics Engineering, Ajou University
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LEE Hai-Young
Department of Electronics Engineering, Ajou University
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KWON Young-Soo
Department of Electrical Engineering & NTRC, Dong-A University
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Park Jae-young
Lg Electronics Institute Of Technology
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