Metal Organic Atomic Layer Deposition of Metal Silicate Film for High-$k$ Gate Dielectrics
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概要
- 論文の詳細を見る
We investigated the use of atomic layer deposition to fabricate metal silicate film for high-$k$ gate dielectrics. We used a metal organic precursor and alternate exposures of Ar plasma to achieve ion-assisted mixing of metal atoms into the substrate during each ALD cycle. The concentration of metal atoms was varied by changing the length of the cycles. The electrical characteristics of the silicate film were better than those of film fabricated using O2 plasma or H2O irradiation.
- Japan Society of Applied Physicsの論文
- 2004-10-01
著者
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Tatsumi Toru
System Devices And Fundamental Research Nec Corporation
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Endo Kazuhiko
System Devices Research Laboratories, NEC Corporation, 1120 Shimokuzawa, Sagamihara, Kanagawa 229-1198, Japan
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Tatsumi Toru
System Devices Research Laboratories, NEC Corporation, 1120 Shimokuzawa, Sagamihara, Kanagawa 229-1198, Japan
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