Low-Temperature Au-to-Au Bonding for LiNbO_3/Si Structure Achieved in Ambient Air(Micro/Nano Fabrication,<Special Section>Microoptomechatronics)

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概要

• 論文の詳細を見る

• A lithium niobate (LiNbO_3)/silicon (Si) hybrid structure has been developed by the surface-activated bonding of LiNbO_3 chips with gold (Au) thin film to Si substrates with patterned Au film. After organic contaminants on the Au surfaces were removed using argon radio-frequency plasma, Au-to-Au bonding was carried out in ambient air. Strong bonding at significantly low temperatures below 100℃ without generating cracks has been demonstrated.

• 社団法人電子情報通信学会の論文
• 2007-01-01

著者

• Shinada Satoshi

  National Institute of Information and Communications Technology, New Generation Network Research Cen

• KAWANISHI Tetsuya

  National Institute of Information and Communications Technology

• Higurashi Eiji

  Res. Center For Advanced Sci. And Technol. The Univ. Of Tokyo

• SUGA Tadatomo

  University of Tokyo, RCAST

• Suga Tadatomo

  School Of Engineering The Univ. Of Tokyo

• Shinada Satoshi

  National Institute Of Information And Communications Technology New Generation Network Research Cent

• Shinada Satoshi

  National Institute Of Information And Technology

• TAKIGAWA Ryo

  University of Tokyo

• HIGURASHI Eiji

  University of Tokyo

• Takigawa Ryo

  School Of Engineering The University Of Tokyo

• Kawanishi Tetsuya

  National Institute Of Information And Technology

• Suga Tadatomo

  University Of Tokyo Department Of Precision Engineering School Of Engineering

• Kawanishi Tetsuya

  National Inst. Of Information And Technol. (nict) Tokyo Jpn

• Shinada Satoshi

  National Institute of Information and Communications Technology

• SUGA Tadatomo

  University of Tokyo

• Shinada Satoshi

  National Institute of Information and Communication Technology

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