Finite element analysis of nanometer-scale contact for low temperature bonding

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概要

• 論文の詳細を見る
• 2006-09-13

著者

• Suga Tadatomo

  University Of Tokyo Department Of Precision Engineering School Of Engineering

• HIGASHINO Tasuku

  University of Tokyo, Department of Precision Engineering, School of Engineering

• Higashino Tasuku

  University Of Tokyo Department Of Precision Engineering School Of Engineering

• SUGA Tadatomo

  University of Tokyo

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• Water Direct Bonding at Room Temperature by Means of the Surface Activated Bonding
• Low-Temperature Au-to-Au Bonding for LiNbO_3/Si Structure Achieved in Ambient Air(Micro/Nano Fabrication,Microoptomechatronics)
• UHV-Bonding and Reversible Interconnection
• Finite element analysis of nanometer-scale contact for low temperature bonding

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