接合中の空隙間隔分布推定手法と密着過程予測モデルの試作 : 固相拡散接合予測支援システムに関する研究(第1報)

概要

論文の詳細を見る
A model (algorithm) for the interfacial contacting process in the solid state diffusion bonding has been developed to establish the support system for prediction of the solid state diffusion bonding. By taking into account the change in the void spacing during bonding, the model was updated from the existing model which Takahashi et al. had proposed. The method (overlap process) for estimating the void spacing on the bond-interface is firstly proposed. Four fundamental bonding mechanisms are introduced in order to update the bonding model. The calculated results are compared with experimental ones and they agree well. The present model predicts the latter stage of bonding (the percentage bonded area greater than 50%) which largely depends on the void spacing, although the time required to complete the full contact has not been exactly estimated.
社団法人溶接学会の論文
1996-11-05