TED-AJ03-106 HIGH HEAT FLUX COOLING FOR ELECTRONIC DEVICES BY SUBCOOLED FLOW BOILING WITH MICROBUBBLE EMISSION

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Subcooled flow boiling of water with microbubble emission in a horizontal rectangular channel has been studied for high heat flux cooling of electronic devices. A heating surface, 10 mm ×10 mm, is referred as a cooling surface of IC chip and placed at the bottom of the channel. Microbubble emission boiling occurs at high subcooling of liquid in transition boiling and the heat flux increases higher than the critical heat flux. The maximum heat flux reaches 10 MW/m^2 for the channel with a cross section of 17 mm ×12 mm at 40 K of liquid subcooling and 0.5 m/s of liquid velocity as shown in Fig.A-1.[figure] For the smaller channels, the maximum heat flux is 7 MW/m^2 that is more than 7 times of cooling limit of widely used power IC. For a heating surface with small multi-channel formed by fins fitted on the surface, the maximum heat flux is also about 7 MW/m^2 same as the flat surface. In the estimation of cooling performance for an IC package, 10 cm ×10 cm, with multi-channel using the experimental data, the maximum surface temperature is maintained below 120 ℃ for the higher power generation of 4 MW/m^2 (400W/(cm)^2) as shown in Fig.A-2.[figure]
一般社団法人日本機械学会の論文