焼結助剤の異なるSiC焼結体とAg-Cu-Ti合金との接合界面構造

概要

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A TEM observation and an EDX analysis were carried out on interfaces between Ag-Cu-2 wt%Ti alloy and three types of SiC containing B and C, BeO or Al_2O_3 as additives. They were brazed at temperatures of 850゜ or 950℃ for 30 min. Interfacial structures of the specimens joined at 850℃ were SiC (containing B+C)/TiC/Ti_5Si_3/brazing metal, SiC (containing Al_2O_3)/amorphous oxide/TiC/Ti_5Si_3/brazing metal and SiC (containing BeO)/brazing metal/TiC/Ti_5Si_3/brazing metal. The amorphous oxide disappeared in the specimen brazed at 950℃ using the SiC containing Al_2O_3. The bonding strength of SiC containing Al_2O_3 with itself using the same brazing alloy was nearly the same with that of the SiC containing B and C, but interfacial strength between SiC containing BeO and the reaction layer was much lower. The difference in interfacial structure was discussed in terms of excess C in the SiC ceramics and changes in the diffusion coefficients of Si and C in SiC ceramics, those are influenced by the sintering additives.
社団法人日本セラミックス協会の論文
1993-03-01