Micro-Structural Study of Fretting Contact Caused by the Difference of the Tin Plating Thickness
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概要
- 論文の詳細を見る
In recent years, there has been increasing demand to miniaturize wiring harness connectors in automobiles due to the increasing volume of electronic equipment and the reduction of the installation space allocated for the electronic equipment in automobiles for the comfort of the passengers. With this demand, contact failure caused by the fretting corrosion is expected to become a serious problem. In this report, we examined micro-structural observations of fretting contacts of two different tin plating thicknesses using Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM) and so on. Based on the results, we compared the microstructure difference of fretting contact caused by the difference of the tin plating thickness.
- （社）電子情報通信学会の論文
- 2008-08-01
著者
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Saitoh Yasushi
Mie University Graduate School Of Engineering Vehicle Network Technology Laboratory
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Sawada Shigeru
Mie Univ. Tsu‐shi Jpn
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HATTORI Yasuhiro
AutoNetworks Technologies, Ltd.
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ITO Tetsuya
Circuits and Connection R&D Division, AutoNetworks Technologies, Ltd.
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SAWADA Shigeru
Circuits and Connection R&D Division, AutoNetworks Technologies, Ltd.
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HATTORI Yasuhiro
Circuits and Connection R&D Division, AutoNetworks Technologies, Ltd.
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SAITOH Yasushi
Graduate School of Engineering, Mie University
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TAMAI Terutaka
Graduate School of Engineering, Mie University
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IIDA Kazuo
Graduate School of Engineering, Mie University
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Iida Kazuo
Graduate School Of Engineering Mie University
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Ito Tetsuya
Circuits And Connection R&d Division Autonetworks Technologies Ltd.
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Tamai Terutaka
Mie Univ.
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Saitoh Yasushi
Graduate School Of Engineering Mie University
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Hattori Yasuhiro
Autonetworks Tech.
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Hattori Yasuhiro
Circuits And Connection R&d Division Autonetworks Technologies Ltd.
関連論文
- Press-Fit Connector for Automobile Electronic Control Units(Connectors & Sliding Contacts,Recent Development of Electromechanical Devices (Selected Papers from ICEC2006))
- Study of Fretting Corrosion in Early Stage
- Frequency Influencing of Fretting Corrosion of Tin Plated Contacts(Session 1 -Fretting-)
- Growth of Oxide Film on the Tin Plated Surface of Connector Contacts and Its effect Contact Resistance Characteristic
- The mechanism of a detailed surface transformation of fretting corrosion
- Influence of Fretting Wear on Lifetime of Tin Plated Connectors
- Electric Properties and Surface Conditions of Tin Plated Contact with Load
- Micro-Structural Study of Fretting Contact Caused by the Difference of the Tin Plating Thickness
- Contact Resistance Characteristics of Improved Conductive Elastomer Contacts for Contaminated Printed Circuit Board in SO_2 Environment
- Micro-structural Study of Fretting Contact caused by the difference of the tin plating thickness(Session 1 -Fretting-)
- Microscopic Observation of Fretting Corrosion of Tin plated Contacts(Session 1 -Fretting-)
- Numerical Analyses for Contact Resistance due to Constriction Effect of Current Flowing through Multi-Spot Construction
- Contact Mechanisms and Contact Resistance Characteristics of Solid Tin and Plated Tin Contacts Used for Connectors
- Constriction Resistance Behavior of a Tin or Silver Plated Layer for an Electrical Contact
- Constriction resistance analysis of multi-contact spots
- Contact Area Analysis by FEM with Plating Layer for Electrical Contact
- Contact Mechanisms and Contact Resistance Characteristics of Solid Tin and Plated Tin Contacts
- Prediction of resistance of electric contact with plated layer (1) : Theoretical analyses
- Prediction of resistance of electrical contact with plated layer (2) : Contact area by FEM analysis
- Observations of Structural Transition of Tin Plated Fretting Contacts using FIB-SEM
- Contact Resistance Characteristics of Complex Structure Contacts for Contaminated Printed Circuit Board in SO_2 Environment(Session 6 -Fundamentals-)
- Factors Influencing the Fretting Corrosion of Tin Plated Contacts(Contact Phenomena,Recent Development of Electromechanical Devices (Selected Papers from ICEC2006))
- Observation of Tin Plated Fretting Contacts using FIB-SEM
- Effect of Humidity on Growth of Oxide Film on Surface of Copper Contacts(Contact Phenomena,Recent Development of Electromechanical Devices (Selected Papers from ICEC2006))
- Observation of Tin Plated Fretting Contacts Using FIB-SEM
- Stress-Strain Response of Copper-based Spring Materials under Forward and Reverse Deformations and Its Mathematical Description II
- Deformation of Crystal Morphology in Tin Plated Contact Layer caused by Loading
- Current Density Analysis in Contact Area by Using Light Emission Diode Wafer
- Estimation of Contact Resistance of Tin Plated Contacts by Fretting Corrosion
- Observations of Structural Transition of Tin Plated Fretting Contacts Using FIB-SEM
- Growth Characteristics of Carbon Nanotubes on Oxidized Catalyst under Low-Pressure Condition
- Deformation of Crystal Morphology in Tin Plated Contact Layer Caused by Loading
- Estimation of Contact Resistance of Tin Plated Contacts by Fretting Corrosion
- Stress-Strain Response of Copper-based Spring Materials under Forward and Reverse Deformations and Its Mathematical Description II
- Effect of viscosity or additive substance of contact oil on contact resistance
- Deformation of Crystal Morphology in Tin Plated Contact Layer Caused by Loading