Sawada Shigeru | Mie Univ. Tsu‐shi Jpn

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著作論文

Frequency Influencing of Fretting Corrosion of Tin Plated Contacts(Session 1 -Fretting-)
Growth of Oxide Film on the Tin Plated Surface of Connector Contacts and Its effect Contact Resistance Characteristic
Influence of Fretting Wear on Lifetime of Tin Plated Connectors
Micro-Structural Study of Fretting Contact Caused by the Difference of the Tin Plating Thickness
Micro-structural Study of Fretting Contact caused by the difference of the tin plating thickness(Session 1 -Fretting-)
Microscopic Observation of Fretting Corrosion of Tin plated Contacts(Session 1 -Fretting-)
Numerical Analyses for Contact Resistance due to Constriction Effect of Current Flowing through Multi-Spot Construction
Contact Mechanisms and Contact Resistance Characteristics of Solid Tin and Plated Tin Contacts Used for Connectors
Constriction Resistance Behavior of a Tin or Silver Plated Layer for an Electrical Contact
Constriction resistance analysis of multi-contact spots
Contact Area Analysis by FEM with Plating Layer for Electrical Contact
Contact Mechanisms and Contact Resistance Characteristics of Solid Tin and Plated Tin Contacts
Prediction of resistance of electric contact with plated layer (1) : Theoretical analyses
Prediction of resistance of electrical contact with plated layer (2) : Contact area by FEM analysis
Deformation of Crystal Morphology in Tin Plated Contact Layer caused by Loading
Current Density Analysis in Contact Area by Using Light Emission Diode Wafer
Estimation of Contact Resistance of Tin Plated Contacts by Fretting Corrosion
Deformation of Crystal Morphology in Tin Plated Contact Layer Caused by Loading
Deformation of Crystal Morphology in Tin Plated Contact Layer Caused by Loading

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