Deformation of Crystal Morphology in Tin Plated Contact Layer Caused by Loading
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概要
- 論文の詳細を見る
- 2012-09-01
著者
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Sawada Shigeru
Mie Univ. Tsu‐shi Jpn
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Tamai Terutaka
Mie Univ.
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Hattori Yasuhiro
Autonetwork Technologies Ltd.
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TAMAI Terutaka
Mie University
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SAWADA Shigeru
Mie University
関連論文
- Press-Fit Connector for Automobile Electronic Control Units(Connectors & Sliding Contacts,Recent Development of Electromechanical Devices (Selected Papers from ICEC2006))
- Study of Fretting Corrosion in Early Stage
- Frequency Influencing of Fretting Corrosion of Tin Plated Contacts(Session 1 -Fretting-)
- Growth of Oxide Film on the Tin Plated Surface of Connector Contacts and Its effect Contact Resistance Characteristic
- The mechanism of a detailed surface transformation of fretting corrosion
- Influence of Fretting Wear on Lifetime of Tin Plated Connectors
- Electric Properties and Surface Conditions of Tin Plated Contact with Load
- Micro-Structural Study of Fretting Contact Caused by the Difference of the Tin Plating Thickness
- Contact Resistance Characteristics of Improved Conductive Elastomer Contacts for Contaminated Printed Circuit Board in SO_2 Environment
- Micro-structural Study of Fretting Contact caused by the difference of the tin plating thickness(Session 1 -Fretting-)
- Microscopic Observation of Fretting Corrosion of Tin plated Contacts(Session 1 -Fretting-)
- Numerical Analyses for Contact Resistance due to Constriction Effect of Current Flowing through Multi-Spot Construction
- Contact Mechanisms and Contact Resistance Characteristics of Solid Tin and Plated Tin Contacts Used for Connectors
- Constriction Resistance Behavior of a Tin or Silver Plated Layer for an Electrical Contact
- Constriction resistance analysis of multi-contact spots
- Contact Area Analysis by FEM with Plating Layer for Electrical Contact
- Contact Mechanisms and Contact Resistance Characteristics of Solid Tin and Plated Tin Contacts
- Prediction of resistance of electric contact with plated layer (1) : Theoretical analyses
- Prediction of resistance of electrical contact with plated layer (2) : Contact area by FEM analysis
- Observations of Structural Transition of Tin Plated Fretting Contacts using FIB-SEM
- Contact Resistance Characteristics of Complex Structure Contacts for Contaminated Printed Circuit Board in SO_2 Environment(Session 6 -Fundamentals-)
- Factors Influencing the Fretting Corrosion of Tin Plated Contacts(Contact Phenomena,Recent Development of Electromechanical Devices (Selected Papers from ICEC2006))
- Observation of Tin Plated Fretting Contacts using FIB-SEM
- Effect of Humidity on Growth of Oxide Film on Surface of Copper Contacts(Contact Phenomena,Recent Development of Electromechanical Devices (Selected Papers from ICEC2006))
- Observation of Tin Plated Fretting Contacts Using FIB-SEM
- Deformation of Crystal Morphology in Tin Plated Contact Layer caused by Loading
- Current Density Analysis in Contact Area by Using Light Emission Diode Wafer
- Estimation of Contact Resistance of Tin Plated Contacts by Fretting Corrosion
- Observations of Structural Transition of Tin Plated Fretting Contacts Using FIB-SEM
- Deformation of Crystal Morphology in Tin Plated Contact Layer Caused by Loading
- Fretting Characteristics of Dissimilar Metal Contacts
- Experimental and Calculated Cyclic Elasto-Plastic Deformations of Copper-Based Spring Materials
- Fretting Characteristics of Dissimilar Metal Contacts
- Deformation of Crystal Morphology in Tin Plated Contact Layer Caused by Loading