Electric Properties and Surface Conditions of Tin Plated Contact with Load
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概要
- 論文の詳細を見る
Recently, besides usual driving, the performances of automotive have been diversified to need safety, comfort and so on for user. Then most of controls of the automotive depend on electrical and electronic devices. Since connectors and electric wires act as the electrical transmission system, reliability of the connection becomes more important. It is necessary for connector contacts to achieve low electrical contact resistance and high corrosion resistant in addition to such mechanical property as shock resistant. It is important to investigate contact phenomena with tin plated on copper alloy base metals as same as practice connects for automobile application. In this study, we investigate basic properties of contact force-contact resistance and surface condition, as a results crystal grain pulled up by contact or whisker affects electric properties.
- 社団法人電子情報通信学会の論文
- 2008-11-08
著者
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Saitoh Yasushi
Mie University Graduate School Of Engineering Vehicle Network Technology Laboratory
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HATTORI Yasuhiro
AutoNetworks Technologies, Ltd.
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TAMAI Terutaka
Mie University, Graduate School of Engineering, Vehicle Network Technology Laboratory
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IIDA Kazuo
Mie University, Graduate School of Engineering, Vehicle Network Technology Laboratory
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IIDA Kazuo
Graduate School of Engineering, Mie University
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NAKAMURA Shinya
Mie University, Graduate School of Engineering, Vehicle Network Technology Laboratory
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Iida Kazuo
Graduate School Of Engineering Mie University
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Tamai Terutaka
Mie Univ.
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Hattori Yasuhiro
Autonetworks Tech.
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Hattori Yasuhiro
Autonetwork Technologies Ltd.
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Nakamura Shinya
Mie University Graduate School Of Engineering Vehicle Network Technology Laboratory
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IIDA Kazuo
Mie University
関連論文
- Press-Fit Connector for Automobile Electronic Control Units(Connectors & Sliding Contacts,Recent Development of Electromechanical Devices (Selected Papers from ICEC2006))
- Study of Fretting Corrosion in Early Stage
- Frequency Influencing of Fretting Corrosion of Tin Plated Contacts(Session 1 -Fretting-)
- Growth of Oxide Film on the Tin Plated Surface of Connector Contacts and Its effect Contact Resistance Characteristic
- The mechanism of a detailed surface transformation of fretting corrosion
- Influence of Fretting Wear on Lifetime of Tin Plated Connectors
- Electric Properties and Surface Conditions of Tin Plated Contact with Load
- Micro-Structural Study of Fretting Contact Caused by the Difference of the Tin Plating Thickness
- Contact Resistance Characteristics of Improved Conductive Elastomer Contacts for Contaminated Printed Circuit Board in SO_2 Environment
- Micro-structural Study of Fretting Contact caused by the difference of the tin plating thickness(Session 1 -Fretting-)
- Microscopic Observation of Fretting Corrosion of Tin plated Contacts(Session 1 -Fretting-)
- Numerical Analyses for Contact Resistance due to Constriction Effect of Current Flowing through Multi-Spot Construction
- Contact Mechanisms and Contact Resistance Characteristics of Solid Tin and Plated Tin Contacts Used for Connectors
- Constriction Resistance Behavior of a Tin or Silver Plated Layer for an Electrical Contact
- Constriction resistance analysis of multi-contact spots
- Contact Area Analysis by FEM with Plating Layer for Electrical Contact
- Contact Mechanisms and Contact Resistance Characteristics of Solid Tin and Plated Tin Contacts
- Prediction of resistance of electric contact with plated layer (1) : Theoretical analyses
- Prediction of resistance of electrical contact with plated layer (2) : Contact area by FEM analysis
- Observations of Structural Transition of Tin Plated Fretting Contacts using FIB-SEM
- Contact Resistance Characteristics of Complex Structure Contacts for Contaminated Printed Circuit Board in SO_2 Environment(Session 6 -Fundamentals-)
- Factors Influencing the Fretting Corrosion of Tin Plated Contacts(Contact Phenomena,Recent Development of Electromechanical Devices (Selected Papers from ICEC2006))
- Observation of Tin Plated Fretting Contacts using FIB-SEM
- Effect of Humidity on Growth of Oxide Film on Surface of Copper Contacts(Contact Phenomena,Recent Development of Electromechanical Devices (Selected Papers from ICEC2006))
- Observation of Tin Plated Fretting Contacts Using FIB-SEM
- Deformation of Crystal Morphology in Tin Plated Contact Layer caused by Loading
- Current Density Analysis in Contact Area by Using Light Emission Diode Wafer
- Estimation of Contact Resistance of Tin Plated Contacts by Fretting Corrosion
- Observations of Structural Transition of Tin Plated Fretting Contacts Using FIB-SEM
- Growth Characteristics of Carbon Nanotubes on Oxidized Catalyst under Low-Pressure Condition
- Deformation of Crystal Morphology in Tin Plated Contact Layer Caused by Loading
- Estimation of Contact Resistance of Tin Plated Contacts by Fretting Corrosion
- Fretting Characteristics of Dissimilar Metal Contacts
- Experimental and Calculated Cyclic Elasto-Plastic Deformations of Copper-Based Spring Materials
- Fretting Characteristics of Dissimilar Metal Contacts
- Effect of viscosity or additive substance of contact oil on contact resistance
- Partial discharge characteristics in epoxy cast molding insulation system by X-ray irradiation
- Partial discharge characteristics in epoxy cast molding insulation system by X-ray irradiation
- Deformation of Crystal Morphology in Tin Plated Contact Layer Caused by Loading