Growth of Oxide Film on the Tin Plated Surface of Connector Contacts and Its effect Contact Resistance Characteristic

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Tin plating has been applied widely to electrical connector contacts to save the cost. However, the tin plated surfaces are covered with oxide film which is fundamentally different from gold plated surfaces. The oxide film prevents the surface from corrosion. When the film is interposed between contact interface, contact resistance increases. It is necessary to break down mechanically to obtain low contact resistance. However, detail studies on the oxide film on the tin plated surfaces are not found in literatures. On the other hand, fretting phenomena is very important for connector contacts, particularly, for automotive connectors under vibration. The failure to tin plated caused many times by fretting, and there phenomena are reported in the literatures. In the present study, growth law of the oxide film on the tin plated surface was found by measurement using an ellipsometry for exposure to the atmosphere. Moreover, the film thickness was identified by TEM (Transmission Electron Microscope). The results well agreed with results obtained by the ellipsometry. Moreover, we could observe successfully that the composition of oxide film on tin plated surface at 120℃ has mixture of amorphous SnO and crystallized SnO_<2>. The contact resistance showed different characteristic by mixture SnO and SnO_2 compared with the film at room temperature. Growth of the oxide film showed the law of three patterns. From this result, oxidation constants in Arrhenius equation were determined. The contact resistance indicated low constant value until 10nm in thickness. This low value is due to conduction mechanisms of thin film. For the thicker film than 10nm, contact resistance increased to 5Ω.
社団法人電子情報通信学会の論文
2009-11-12

Growth of Oxide Film on the Tin Plated Surface of Connector Contacts and Its effect Contact Resistance Characteristic

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