An Excellent Cu Diffusion Barrier for Next Generation Multi-level Cu-interconnect
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概要
- 論文の詳細を見る
- 2006-09-13
著者
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TSUI Bing-Yue
Department of Electronics Engineering and Institute of Electronics, National Chiao-Tung University
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Tsui Bing-yue
Department Of Electronics Engineering & Institute Of Electronics National Chiao Tung University
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Huang Chih-feng
Department Of Electronics Engineering & Institute Of Electronics National Chiao Tung University
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LEE Chia-Jung
Department of Electronics Engineering & Institute of Electronics, National Chiao Tung University
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Lee Chia-jung
Department Of Electronics Engineering & Institute Of Electronics National Chiao Tung University
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