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Semiconductor Research Center, Matsushita Electric Industrial Company, Ltd. | 論文
- New Technologies of KrF Excimer Laser Lithography System in 0.25 Micron Complex Circuit Patterns (Special Issue on Quarter Micron Si Device and Process Technologies)
- Quarter Micron KrF Excimer Laser Lithography (Special Issue on Sub-Half Micron Si Device and Process Technologies)
- A New Photobleachable Positive Resist for KrF Excimer Laser Lithography : Advanced III-V Compound Semiconductors and Silicon Devices(Solid State Devices and Materials 1)
- A KrF Excimer Laser Lithography for Half Micron Devices : Techniques, Instrumentations and Measurement
- Overlay Accuracy Measurement Technique Using the Latent Image on a Chemically Amplified Resist
- A New Analytical Technique for Evaluating Standing Wave Effect of Chemically Amplified Positive Resist
- New Evaluation Method of Resist Coating Using Heterodyne Holographic Wafer Alignment
- Application of Photobleachable Positive Resist and contrast Enhancement Material to KrF Excimer Laser Lithography : Resist Material and Process
- Novel Surface Reaction Model in Dry-Etching Process Simulator
- Computer Aided Proximity Effect Correction System in Photolithography : Lithography Technology
- Quantitative Evaluation of Gate Oxide Damage during Plasma Processing Using Antenna-Structure Capacitors
- Tunnel Structured Stacked Capacitor Cell (TSSC) with High Reliability for 64 Mbit dRAMs and Formation of Oxide-Nitride-Oxide Film (ONO) on 3-dimensionally (3d) Storage Electrode
- A 10b 300MHz Interpolated-Parallel A/D Converter (Special Section on the 1992 VLSI Circuits Symposium)
- Lissajous Electron Plasma (LEP) Generation for Dry Etching
- Submicron 3-Dimensional Structure Observation by Cyclotron SEM(Scanning Electron Microscope) : Inspection and Testing
- Submicron 3-Dimensional Structure Observation by Cyclotron SEM(Scanning Electron Microscope)
- A Novel High-Resolution Scanning Electron Microscope for the Surface Analysis of High-Aspect-Ratio Three-Dimensional Structures
- High-Aspect-Ratio Alkaline Surface Treatment Method of Dyed Photoresist
- An E-Beam Direct Write Process for 16M-Bit DRAMs