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Semiconductor Leading Edge Technologies Inc. | 論文
- Fabrication of 0.25-μm Patterns on a Membrane Substrate-Based X-Ray Absorber
- Dependence of Time-Dependent Dielectric Breakdown Lifetime on NH_3-Plasma Treatment in Cu Interconnects
- Change of serum erythropoietin levels after allogeneic bone marrow transplantation
- Changes in M-CSF activity and CFU-GM- Inhibitory activity in the urine of patient with cyclic chronic myelogenous leukemia
- Rearing technique for the oak platypodid beetle, Platypus quercivorus (Murayama)(Coleoptera : Platypodidae), on soaked logs of deciduous oak tree, Quercus serrata Thunb. ex Murray
- 157-nm Single-Layer Resists Based on Main-Chain-Fluorinated Polymers
- Application of Electron Projection Lithography to Via Formation in Two-Layer Metallization
- Extension of the ArF Excimer Lithography to Sub-0.10/μm Design Rule Devices Using Bi-layer Silylation Process
- Sub-0.10 μm Hole Fabrication Using Bilayer Silylation Process for 193 nm Lithography
- Study of L_ dependence of 2-D carrier profile in N-FET by Scanning Tunneling Microscopy
- Boron Diffusion in SiO_2 Involving High-Concentration Effects
- Boron Diffusion in SiO_2 Involving High-Concentration Effects
- Scanning Tunneling Microscopy Study of Submicron-Sized pn Junction on Si(001) Surfaces
- TiN/TiSi_2 Formatiorn Using TiN_x Layer and Its Feasibilities in ULSI
- Performance and Reliability Improvement by Optimized Nitrogen Content of TaSiNx Metal Gate in Metal/HfSiON nFETs
- Novel via Chain Structure for Failure Analysis at 65 nm-Node Fixing OPC Using Inner and Outer via Chain Dummy Patterns(Microelectronic Test Structures)
- Characterization of Low-k Interconnect Dielectrics by EELS
- Nano-meter order Structures of Porous Low-k Films and their Impacts on Cu/Low-k Processes
- A Low Parasitic Capacitance Scheme by Thermally Stable Titanium Silicide Technology for High Speed Complementary-Metal-Oxide-Semiconductor
- Novel Air-gap Formation Technology Using Ru Barrier Metal for Cu Interconnects with High Reliability and Low Capacitance