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NTT Microsystem Integration Laboratories | 論文
- Low-Loss Si Wire Waveguides and their Application to Thermooptic Switches
- Influence of Doping Gradient near a Channel End on Parasitic Series Resistance of Thin-Film Fully-Depleted Metal–Oxide–Semiconductor Field-Effect Transistors
- Polarization Analysis of Light Propagating in Electro-Optic Crystals with Static Birefringence and Its Application to Sensor Design
- Electrodeposition of Water-Repellent Organic Dielectric Film as an Anti-Sticking Coating on Microelectromechanical System Devices
- A Sealing Technique for Stacking MEMS on LSI Using Spin-Coating Film Transfer and Hot Pressing
- Fabrication of Optical Microelectromechanical-System Switches Having Multilevel Mirror-Drive Electrodes
- Force-Sensing Scheme for Small Mechanical Signals in Complementary Metal Oxide Semiconductor Microelectromechanical System Fingerprint Sensor
- Thick-Dielectric Formation and MOSFET Reliability with Spin-Coating Film Transfer and Hot-Pressing Technique for Seamless Integration Technology
- Monolithic Integration Fabrication Process of Thermoelectric and Vibrational Devices for Microelectromechanical System Power Generator
- Non-volatile Al2O3 Memory using Nanoscale Al-rich Al2O3 Thin Film as a Charge Storage Layer
- Electrodeposition of Organic Dielectric Film and Its Application to Vibrational Microelectromechanical System Devices
- Body-Charge-Induced Switching Characteristics in Fully Depleted Silicon-on-Insulator Digital Circuits
- Al/AlN/InP Metal-Insulator-Semiconductor-Diode Characteristics with Amorphous AlN Films Deposited by Electron-Cyclotron-Resonance Sputtering
- Characterization of Metal Insulator Metal Electrical Properties of Electron Cyclotron Resonance Plasma Deposited Ta2O5
- Frequency Response and Applications of Optical Electric-Field Sensor at Frequencies from 20 kHz to 180 GHz
- A Three-Dimensional Micro-Electro-Mechanical System (MEMS) Optical Switch Module Using Low-Cost Highly Accurate Polymer Components
- A 280-MHz CMOS Intra-Symbol Intermittent RF Front End for Adaptive Power Reduction of Wireless Receivers According to Received-Signal Intensity in Sensor Networks
- A reliable procedure in a new power management technique for a 200-Gbps packet forwarding LSI
- Fabrication of a Nanofluidic Channel for SPR Sensing Application Using Glass-to-Glass Anodic Bonding
- Reversible Resistive Switching in Bi4Ti3O12 Thin Films Deposited by Electron Cyclotron Resonance Sputtering