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Fuji Electric Advanced Technology Co. Ltd. | 論文
- Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lead-Free Alloy under Heat Exposure Conditions
- Relationship between Surface Roughness and Barrier Uniformity
- Sputter Deposition of YBa_2Cu_3O_ Thin Films with Low Gas Pressure
- High Efficiency PWM Controlled Micro DC-DC Converter for Portable Electronic Equipments
- Energy Dependence of Sensitivity and Its Control by Electrode Design in a-Si:H/c-Si Heterojunction Gamma-Ray Detectors for Dosimeters
- Working Pressure Effects on Deposition of Large-Area Microcrystalline Silicon Films on Flexible Plastic Substrate at 130℃ : Semiconductors
- Excitation Frequency Effects on Large-Area Hydrogenated Amorphous Silicon Film Deposition Process Using Flexible Film Substrate : Semiconductors
- Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode
- Highly Texturized Silver Electrode Deposition Using Roll-to-Roll Low-Temperature Sputtering Process
- 120 POWDERTRANSPORTATION DEVICE USING A UNIMORPH PIEZOELECTRIC ACTUATOR(O.S.1 Usage of Sound Energy)
- Local Oxidation of 6H-SiC
- Numerical Simulation of Static and Dynamic Characteristics of Dual-Gate Metal Oxide Semiconductor Thyristor
- Excitation Frequency Effects on Stabilized Efficiency of Large-Area Amorphous Silicon Solar Cells Using Flexible Plastic Film Substrate
- Plasma CVD-Grown ^B-Enriched Boron Films for Si Neutron Detectors
- High-Voltage p-Channel Level Shifter Using Charge-Controlled Self-Isolation Structure
- Proposal of New Interconnection Technique for Very High-Voltage IC's
- Generation Mechanism of Electrochemical Migration in Printed Wiring Board Insulation
- Latest Technical Trend of Arc Plasma, Electrical Contacts, and their Applications
- Enhanced Oxidation of Ion-Implanted Si-Face of 6H-SiC
- Incorporation of Cl into Hydrogenated Amorphous Silicon without Optical Band Gap Widening : Semiconductors