Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2008-07-01
著者
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SHOHJI Ikuo
Department of Mechanical System Engineering, Graduate School of Engineering, Gunma University
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Osawa Tsutomu
Department of Cardio-Angiology, Kitasato University School of Medicine
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Shohji Ikuo
Department Of Mechanical System Engineering Graduate School Of Engineering Gunma University
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Osawa Tsutomu
Department Of Mechanical System Engineering Graduate School Of Engineering Gunma University
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WATANABE Hirohiko
Fuji Electric Advanced Technology Co., Ltd.
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Watanabe Hirohiko
Fuji Electric Advanced Technology Co. Ltd.
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OKASHITA Takeshi
Department of Mechanical System Engineering, Faculty of Engineering, Gunma University
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Okashita Takeshi
Department Of Mechanical System Engineering Faculty Of Engineering Gunma University
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Watanabe Hirohiko
Fuji Electric Advanced Technol. Co. Ltd.
関連論文
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- Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating
- PE-095 Clinical Characteristics of Severe Heart Failure Patients with Low Plasma Levels of B-type Natriuretic Peptide(Heart failure, clinical(07)(M),Poster Session(English),The 72nd Annual Scientific Meeting of the Japanese Circulation Society)
- Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode
- Cu-Sn-Zr-P Alloy for a High-Strength Heat-Exchanger Tube