Takeyama M | Kitami Inst. Technol. Kitami Jpn
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概要
関連著者
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Noya Atsushi
Department Of Electrical And Electronic Engineering Faculty Of Engineering Kitami Institute Of Techn
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Takeyama M
Kitami Inst. Technol. Kitami Jpn
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Takeyama Mayumi
Department Of Electrical And Electronic Engineering Faculty Of Engineering Kitami Institute Of Techn
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Sasaki Katsutaka
Department Of Electrical And Electronic Engineering Faculty Of Engineering Kitami Institute Of Techn
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HIRAGA Kenji
Institute for Materials Research, Tohoku University
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Hiraga K
Institute For Materials Research Tohoku University
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Hiraga Kenji
Institute For Materials Research
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Aoyagi E
Tohoku Univ. Sendai Jpn
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Aoyagi Eiji
Institute For Materials Research Tohoku University
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Ichikawa T
Fdk Corp. Shizuoka Jpn
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Ichikawa Takaaki
Department Of Applied Physics Okayama University Of Science
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Seki H
Ibm Almaden Res. Center Ca Usa
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Seki Hikaru
Department Of Electrical And Electronic Engineering Faculty Of Engineering Kitami Institute Of Techn
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SASAKI Katsutaka
Department of Materials Science, Kitami Institute of Technology
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TAKEYAMA Mayumi
Department of Electrical and Electronic Engineering, Faculty of Engineering, Kitami Institute of Tec
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NOYA Atsushi
Department of Electrical and Electronic Engineering, Faculty of Engineering, Kitami Institute of Tec
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SAKANISHI Kouichirou
Department of Electrical and Electronic Engineering, Faculty of Engineering, Kitami Institute of Tec
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Taguchi Masahiro
Department Of Molecular Biotechnology Graduate School Of Advanced Sciences Of Matter Hiroshima Unive
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Sakanishi Kouichirou
Department Of Electrical And Electronic Engineering Faculty Of Engineering Kitami Institute Of Techn
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Taguchi Masahiro
Department Of Electrical And Electronic Engineering Faculty Of Engineering
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SEKI Hikaru
Department of Biotechnology, Graduate School of Engineering, Osaka University
著作論文
- Solid-Phase Reactions of Diffusion Barriers of Ti and TiN to Copper Layers on SiO_2
- Transmissin Electron Microscopy Observation of Polymorphic Epitaxial Growth of YSi_ Layer in Al(001)/YSi_/Si(001) Systems
- Thermal Stability of W_2N Film as a Diffusion Barrier between Al and Si
- Oxidation Behavior of Ta Thin Films as a Passivation Layer Deposited on Cu
- Oxidation Characteristics of Al–Ta Thin Alloy Films as a Passivation Layer on Cu
- Effects of Al3Ta/TaN Bilayered Diffusion Barriers in the Al/Si Contact Systems
- Auger Electron Spectroscopy Study on the Stability and the Interfacial Reaction of Ta, Ta-N arnd TaN Films as a Diffusion Barrier between Cu_9Al_4 Film and Si
- Characterizations and Barrier Properties of WN_x Film in the Al_W/WN_x/Si Contact System