Yamaguchi Hizuru | Device Development Center Hitachi Ltd.
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概要
関連著者
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Yamaguchi Hizuru
Device Development Center Hitachi Ltd.
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武田 健一
日立製作所 中央研究所
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Hinode Kenji
Central Research Laboratory Hitachi Lid.
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Takeda Ken-ichi
Central Research Laboratory Hitachi Ltd.
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YAMAGUCHI Hizuru
Device Development Center, Hitachi Ltd.
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Noguchi Junji
Device Development Center Hitachi Ltd.
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Hinode Kenji
Istec/srl
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Hinode Kenji
Central Research Laboratory Hitachi Ltd.
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NOGUCHI Junji
Device Development Center, Hitachi Ltd.
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Takeda Ken'ichi
Central Research Laboratory Hitachi Ltd.
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Takeda Ken-ichi
Central Research Laboratory, Hitachi Ltd., Kokubunji-shi, Tokyo 185-8601, Japan
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Takeda Ken-ichi
Hitachi, Ltd., Central Research Laboratory, 1-280 Higashikoigakubo Kokubunji-shi, Tokyo 185-8601, Japan
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Takeda Ken-ichi
Hitachi, Ltd., Central Research Laboratory, Kokubunji, Tokyo 185-8601, Japan
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Takeda Ken-ichi
Central Research Laboratory, Hitachi Ltd., Higashikoigakubo, Kokubunji, Tokyo 185-8601, Japan
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Hashimoto Takashi
Device Development Center, Hitachi, Ltd.
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YAMAGUCHI Hizuru
Renesas Technology Corp.
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Ohashi Naofumi
Device Development Center Hitachi Ltd.
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SAITO Tatsuyuki
Device Development Center, Hitachi Ltd.
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FUJIWARA Tsuyoshi
Device Development Center, Hitachi Ltd.
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Saito Tatsuyuki
Device Development Center Hitachi Ltd.
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Hirasawa Shigeki
Mechanical Engineering Research Laboratory Hitachi Ltd.
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Saito Yoko
Mechanical Engineering Research Laboratory Hitachi Ltd.
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Fujiwara Tsuyoshi
Device Development Center Hitachi Ltd.
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Hashimoto Takashi
Device Development Center Hitachi Ltd.
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Owada Nobuo
Device Development Center Hitachi Ltd.
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Endo Michiko
Mechanical Engineering Research Laboratory Hitachi Ltd.
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Yamaguchi Hizuru
Device Development Center, Hitachi Ltd., Ome-shi, Tokyo 198-8512, Japan
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YAMAGUCHI Hizuru
Device Development Center, Hitachi, Ltd.
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Noguchi Junji
Device Development Center, Hitachi Ltd., Ome-shi, Tokyo 198-8512, Japan
著作論文
- Light Emission Analysis of Dielectric Breakdown in Stressed Damascene Copper Interconnection
- Dielectric Breakdown and Light Emission in Copper Damascene Structure under Bias-Temperature Stress
- Copper Wires for High Speed Logic LSI Prepared by Low Pressure Long Throw Sputtering Method
- Fast Computation of Microscale Temperature Distribution in LSI Chips
- Light Emission Analysis of Dielectric Breakdown in Stressed Damascene Copper Interconnection