KURINO Hiroyuki | Tohoku University
スポンサーリンク
概要
関連著者
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小柳 光正
東北大学大学院工学研究科機械知能工学専攻知能システム設計学研究室
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KURINO Hiroyuki
Tohoku University
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Kurino H
Dept. Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University
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Kurino Hiroyuki
Department Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University
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Kurino H
Tohoku University
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KURINO Hiroyuki
Department of Machine Intelligence and Systems Engineering, Tohoku University
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KOYANAGI Mitsumasa
Department of Machine Intelligence and Systems Engineering, Tohoku University
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Park Ki-tae
Halo Lsi Inc.:tohoku University
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Koyanagi Mitsumasa
Department Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University
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佐久間 克幸
日本アイ・ビー・エム株式会社東京基礎研究所
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SAKUMA Katsuyuki
Department of Machine Intelligence and Systems Engineering, Tohoku University
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Lee Kang-wook
Tohoku University
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KOYANAGI Mitsumasa
Dept. Bioengineering and Robotics, Tohoku University
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NAKAMURA Tomonori
Tohoku University
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KOYANAGI Mitsumasa
Tohoku University
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Nakamura Tairiku
Research Institute Of Electrical Communication Tohoku University
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MIZUKUSA Tomokatsu
Tohoku University
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WON Hyo-Sig
Samsung Electronics Co. Ltd.
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KURINO Hiroyuki
Dept. of Machine Intelligence and Systems Engineering, Tohoku University
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Nakamura T
Department Of Bioengineering And Robotics Tohoku University
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Kurino Hiroyuki
Dept. Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University
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NAKAMURA Tomonori
Department of Molecular Pharmacology and Pharmacotherapeutics, Graduate School of Pharmaceutical Sci
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LEE Kang
Department of Machine Intelligence and Systems Engineering, Tohoku University
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MIYAKAWA Nobuaki
Advanced Technology Center, Fuji Xerox Co.
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Park Ki
Department Of Machine Intelligence And Systems Engineering Tohoku University
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Choi Kyu-myung
Samsung Electronics Co. Ltd.
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Kong Jeong-Taek
Samsung Electronics Co., Ltd.
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PARK Ki-Tae
Department of Machine Intelligence and Systems Engineering, Tohoku University
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Lee Kang
Department Of Electronics Engineering Konkuk University
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Kong Jeong-taek
Samsung Electronics Co. Ltd.
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Hirose Akinori
Department Of Materials Science University Of Osaka Prefecture
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Nakamura Tomonori
Department Of Molecular Pharmacology And Pharmacotherapeutics Graduate School Of Pharmaceutical Scie
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Miyakawa N
Advanced Technology Center Fuji Xerox Co.
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KUWANA Yasuhiro
Dept. of Machine Intelligence and System Engineering, Tohoku University
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Lee Kang
Department Of Chemistry Research Institute Of Natural Science And Environmental Biotechnology Nation
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Kuwana Yasuhiro
Dept. Of Machine Intelligence And System Engineering Tohoku University
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Lee Kang
Department of Bioengineering and Robotics, Tohoku University, 6-6-01 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8578, Japan
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Nakamura Tomonori
Department of Bioengineering and Robotics, Tohoku University, 01 Aza Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan
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Lee Kang
Department of Bioengineering and Robotics, Tohoku University, 6-6-01 Aza Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan
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佐々木 実
Dept. Of Advanced Science And Technology Toyota Technological Institute
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PARK Ki
Department of Machine Intelligence and Systems Engineering, Tohoku University
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SHIMAZUTSU Hiroaki
Research Center, Mitsubishi Heavy Co.
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KIM Ki
Japan Science and Technology Corporation(CREST)
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MATSUMOTO Takuji
Department of Machine Intelligence and System Engineering, Tohoku University
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SATOH Masakazu
Department of Machine Intelligence and System Engineering, Tohoku University
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MIYAKAWA Nobuaki
Fuji Xerox Co., Ltd.
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ITANI Hikotaro
Mitsubishi Heavy Industries, Ltd.
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Sasaki Minoru
Department of Acoustic Design,Kyushu Institute of Design
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Park Ki
Department Of Civil Engineering Faculty Of Engineering Kyushu University
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Hane Kazuhiro
Department Of Mechatronics And Precision Engineering Tohoku University
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Sasaki M
Department Of Physics. Faculty Of Sciences Yamagata University
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Satoh Masakazu
Department Of Machine Intelligence And System Engineering Tohoku University
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Itani Hikotaro
Mitsubishi Heavy Industries Ltd.
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Hong Youn-gi
Department Of Bioengineering And Robotics Tohoku University
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NAKAGAWA Yoshihiro
Tohoku University
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YAMADA Yusuke
Tohoku University
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Matsumoto Takuji
Department Of Machine Intelligence And System Engineering Tohoku University
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Matsumoto Takuji
Department Of Image Science Faculty Of Engineering Chiba University
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羽根 一博
東北大学大学院
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PARK Ki-Tae
Dept. of Machine Intelligence and Systems Engineering, Tohoku University
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MIZUKUSA Tomokatsu
Dept. of Machine Intelligence and Systems Engineering, Tohoku University
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NAKAMURA Natsuo
Department of Machine Intelligence and Systems Engineering, Tohoku University
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SONG Yun-Heub
Department of Machine Intelligence and Systems Engineering, Tohoku University
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Nakamura Natsuo
Department Of Machine Intelligence And Systems Engineering Tohoku University
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HASHIMOTO Toru
Dept. of Machine Intelligence and Systems Engineering, Tohoku University
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PARK Ki
Dept. of Machine Intelligence and Systems Engineering, Tohoku University
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Song Yun-heub
Department Of Machine Intelligence And Systems Engineering Tohoku University
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Nakagawa Yoshihiro
Department Of Bioengineering And Robotics Tohoku University
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Hirose Akinori
Dept. Of Machine Intelligence And System Engineering Tohoku University
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Kim Ki
Japan Fine Ceramics Center
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KUWANA Yasuhiro
Tsukuba Research Laboratory, Hitachi Chemical Co., Ltd.
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HIROSE Akinori
Faculty of Engineering, Tohoku University
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KURINO Hiroyuki
Faculty of Engineering, Tohoku University
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KOYANAGI Mitsumasa
Faculty of Engineering, Tohoku University
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Hane Kazuhiro
Department Of Electronic Mechanical Engineering Faculty Of Engineering Nagoya University
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Hong Youn-gi
Department Of Machine Intelligence And Systems Engineering Tohoku University
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Park Ki
Department Of Agricultural Chemistry Division Of Applied Life Science Gyeongsang National University
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Hashimoto Toru
Dept. Of Machine Intelligence And Systems Engineering Tohoku University
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Sasaki Minoru
Department Of Acoustic Design Kyushu Institute Of Design
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Shimazutsu Hiroaki
Research Center Mitsubishi Heavy Co.
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Song Yun-Heub
Department of Electronic Engineering, Hanyang University, Seoul 133-791, Korea
著作論文
- Development of Three-Dimensional Integration Technology for Highly Parallel Image-Processing Chip
- A New Wafer Scale Chip-on-Chip (W-COC) Packaging Technology Using Adhesive Injection Method
- New Three-Dimensional Wafer Bonding Technology Using the Adhesive Injection Method
- Biologically Inspired Vision Chip with Three Dimensional Structure(Special Issue on Integrated Systems with New Concepts)
- A Power-Down Circuit Scheme Using Data-Preserving Complementary Pass Transistor Flip-Flop for Low-Power High-Performance Multi-Threshold CMOS LSI(Electronic Circuits)
- A Low-Power Edge-Triggered and Logic-Embedded Flip-Flop Using Complementary Pass Transistor Circuit(Electronic Circuits)
- Low-Power Data-Preserving Complementary Pass-Transistor-Based Circuit for Power-Down Circuit Scheme
- Fabrication of Hollow Cylinder Shape Permalloy on the Si Pole
- Ultrashallow Junction Formation by Rapid Thermal Annealing of Arsenic-Adsorbed Layer
- Optical Data Transfer in Multichip Module with Optical Interconnection
- Signal Propagation Characteristics in Polyimide Optical Wave-guide with Micro-Mirrors for Optical Multichip Module
- Signal Propagation Characteristics in Polymide Optical Waveguide with Micro-Mirrors for Optical Multichip Module