SAKUMA Katsuyuki | Department of Machine Intelligence and Systems Engineering, Tohoku University
スポンサーリンク
概要
関連著者
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SAKUMA Katsuyuki
Department of Machine Intelligence and Systems Engineering, Tohoku University
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小柳 光正
東北大学大学院工学研究科機械知能工学専攻知能システム設計学研究室
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佐久間 克幸
日本アイ・ビー・エム株式会社東京基礎研究所
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KURINO Hiroyuki
Department of Machine Intelligence and Systems Engineering, Tohoku University
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KOYANAGI Mitsumasa
Department of Machine Intelligence and Systems Engineering, Tohoku University
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KURINO Hiroyuki
Tohoku University
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Kurino H
Dept. Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University
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Koyanagi Mitsumasa
Department Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University
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Kurino Hiroyuki
Department Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University
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NAKAMURA Tomonori
Department of Molecular Pharmacology and Pharmacotherapeutics, Graduate School of Pharmaceutical Sci
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LEE Kang
Department of Machine Intelligence and Systems Engineering, Tohoku University
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MIYAKAWA Nobuaki
Advanced Technology Center, Fuji Xerox Co.
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Lee Kang-wook
Tohoku University
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NAKAMURA Tomonori
Tohoku University
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Nakamura Tairiku
Research Institute Of Electrical Communication Tohoku University
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Lee Kang
Department Of Electronics Engineering Konkuk University
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Nakamura T
Department Of Bioengineering And Robotics Tohoku University
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Nakamura Tomonori
Department Of Molecular Pharmacology And Pharmacotherapeutics Graduate School Of Pharmaceutical Scie
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Miyakawa N
Advanced Technology Center Fuji Xerox Co.
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Lee Kang
Department Of Chemistry Research Institute Of Natural Science And Environmental Biotechnology Nation
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Lee Kang
Department of Bioengineering and Robotics, Tohoku University, 6-6-01 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8578, Japan
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Nakamura Tomonori
Department of Bioengineering and Robotics, Tohoku University, 01 Aza Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan
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Lee Kang
Department of Bioengineering and Robotics, Tohoku University, 6-6-01 Aza Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan
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Mizuno Jun
Nanotechnology Research Laboratory, Waseda University
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PARK Ki
Department of Machine Intelligence and Systems Engineering, Tohoku University
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SHIMAZUTSU Hiroaki
Research Center, Mitsubishi Heavy Co.
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KIM Ki
Japan Science and Technology Corporation(CREST)
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MATSUMOTO Takuji
Department of Machine Intelligence and System Engineering, Tohoku University
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SATOH Masakazu
Department of Machine Intelligence and System Engineering, Tohoku University
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MIYAKAWA Nobuaki
Fuji Xerox Co., Ltd.
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ITANI Hikotaro
Mitsubishi Heavy Industries, Ltd.
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Shoji Shuichi
School Of Fundamental Science And Engineering Waseda University
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Shoji Shuichi
Department Of Science And Engineering Waseda University
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Park Ki
Department Of Machine Intelligence And Systems Engineering Tohoku University
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Park Ki
Department Of Civil Engineering Faculty Of Engineering Kyushu University
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Mizuno Jun
Nanotechnology Research Laboratory Waseda University
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Mizuno Jun
Department Of Science And Engineering Waseda University
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Satoh Masakazu
Department Of Machine Intelligence And System Engineering Tohoku University
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Itani Hikotaro
Mitsubishi Heavy Industries Ltd.
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Shoji Shuichi
Department Of Electrical Engineering And Bioscience Waseda University
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NAGAI Noriyasu
Department of Science and Engineering, Waseda University
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SAITO Mikiko
Department of Science and Engineering, Waseda University
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Matsumoto Takuji
Department Of Machine Intelligence And System Engineering Tohoku University
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Matsumoto Takuji
Department Of Image Science Faculty Of Engineering Chiba University
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Saito Mikiko
Department Of Science And Engineering Waseda University
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Nagai Noriyasu
Department Of Science And Engineering Waseda University
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Sakuma Katsuyuki
Department Of Science And Engineering Waseda University
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Kurino H
Tohoku University
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Kim Ki
Japan Fine Ceramics Center
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Park Ki
Department Of Agricultural Chemistry Division Of Applied Life Science Gyeongsang National University
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Shimazutsu Hiroaki
Research Center Mitsubishi Heavy Co.
著作論文
- Development of Three-Dimensional Integration Technology for Highly Parallel Image-Processing Chip
- A New Wafer Scale Chip-on-Chip (W-COC) Packaging Technology Using Adhesive Injection Method
- New Three-Dimensional Wafer Bonding Technology Using the Adhesive Injection Method
- Simplified 20-μm Pitch Vertical Interconnection Process for 3D Chip Stacking