Low-Resistance Metal Contacts for Nanocarbon/Cobalt Interconnects (Special Issue : Advanced Metallization for ULSI Applications)
スポンサーリンク
概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
著者
-
UENO Kazuyoshi
Shibaura Institute of Technology, Dept. of Electronic Engineering
-
YAMAZAKI Yuichi
Low-Power Electronics Association and Project (LEAP)
-
KAJITA Akihiro
Low-Power Electronics Association and Project (LEAP)
-
Sakai Tadashi
Low-power Electronics Association & Project (LEAP), Kawasaki 212-8582, Japan
-
Sakai Tadashi
Low-Power Electronics Association and Project (LEAP), Tsukuba, Ibaraki 305-8569, Japan
-
Sakuma Naoshi
Low-power Electronics Association & Project (LEAP), Tsukuba, Ibaraki 305-8569, Japan
-
Takagi Masashi
Shibaura Institute of Technology, Koto, Tokyo 135-8548, Japan
-
Yano Hiroaki
Shibaura Institute of Technology, Koto, Tokyo 135-8548, Japan
-
Wakui Taichi
Shibaura Institute of Technology, Koto, Tokyo 135-8548, Japan
-
Kajita Akihiro
Low-Power Electronics Association and Project (LEAP), Tsukuba, Ibaraki 305-8569, Japan
関連論文
- Chemical vapor deposition of nanocarbon on electroless NiB catalyst using ethanol precursor (Special issue: Advanced metallization for ULSI applications)
- Grain Growth Enhancement of Electroplated Copper Film by Supercritical Annealing
- Key mechanisms for improved EM lifetime of CoWP capped Cu interconnects
- Fabrication and Characterization of Planarized Carbon Nanotube Via Interconnects (Special Issue : Advanced Metallization for ULSI Applications)
- A Study on Electrical Resistance of Carbon Nanotubes and Their Metal Contacts Using Simplified Test Structure (Special Issue : Advanced Metallization for ULSI Applications)
- Current Induced Grain Growth of Electroplated Copper Film (Special Issue : Advanced Metallization for ULSI Applications)
- Low-Temperature Graphene Growth Originating at Crystalline Facets of Catalytic Metal
- Barrier Integrity of Electroless Diffusion Barriers and Organosilane Monolayer against Copper Diffusion under Bias Temperature Stress
- Low-Resistance Metal Contacts for Nanocarbon/Cobalt Interconnects
- Electrical Resistivity Measurements of Layer Number Determined Multilayer Graphene Wiring for Future Large Scale Integrated Circuit Interconnects
- Heat-Resistant Co--W Catalytic Metals for Multilayer Graphene Chemical Vapor Deposition
- Low-Resistance Metal Contacts for Nanocarbon/Cobalt Interconnects (Special Issue : Advanced Metallization for ULSI Applications)
- Electrical Resistivity Measurements of Layer Number Determined Multilayer Graphene Wiring for Future Large Scale Integrated Circuit Interconnects (Special Issue : Microprocesses and Nanotechnology)